Catalogs >
PORTWELL >
EZCool

EZCool
1Pages

Catalog excerpts

EZCool A reliable thermal solution of processor is always highly appreciated for most applications. The reliable solution is not only about whether the processor over its thermal specification or keep its temperature under protection point but also noise and weight related. EZCool is the reliable thermal solution for Intel® CoreTM 2 Duo processor, Pentium® 4 651 and Celeron® D 352 and so on that Thermal Design Power (TDP) does not over 65W because of it's compact size, silent cooling fan and fixing mechanism. SPECIFICATION Socket Type Socket LGA 775 (CoreTM 2 Duo, Celeron® 440) Heat Sink Dimension Heat Sink Material Fan Speed Ball Bearing Voltage Rating Input Current 0.3 A Max. (At 25oC, in free air rated voltage) Noise Level Heat Sink Weight Thermal Interface Material EZCool High effidency and low profile cooler for CoreTM 2 Duo processor Bearing Type 9.11 mmH2O (At zero static pressure and 25oC, rated speed) Model Name & Description 5.76 CFM (At zero static pressure and 25oC, rated speed) ORDERING GUIDE Aluminum extrusion base and fins FEATURES Along with Intel®'s CoreTM Mircoarchitecture and advanced manufacturing technologies, processor Thermal Design Power (TDP) was lower from 85~130W to 65W only, and even lower for single core processor in Q3 this year. As a result, Portwell is able to design a reliable cooler that can fits most applications demanding. Compact Size Bending Prevention EZCool is just one of third height of boxed cooler that benefits applications that need low profile cooler. Larger preload of cooler cause the main board bending and it could introduce permanent damage to the PCB (Print Circuit Board) and traces on it. With back plate conjunction, EZCooler makes no defection of board. Twist Avoidance Semi-symmetric Design Main board fixed vertically in chassis instead of horizontally such as PICMG 1.x SBC/SHB can be twisted because of the weight of cooler. It damages SBC/SHB badly once the platform vibrates or shocks in the same direction. The semi-symmetric heat sink design only allows air flow thru dual directions that can help ventilation of other key components nearby and fully leverage system air flow that draw from outside of the chassis. American Portwell Portwell Japan, Inc. Beijing Portwell Portwell-Laxsons India 3F, No. 92, Sec. 1, Nei-Hu Rd., 114 Taipei, Taiwan Tel: +886-2-27992020 Fax: +886-2-27991010 E-mail: info@portwell.com.tw http: //www.portwell.com.tw 44200 Christy St. Fremont, CA 94538, USA Tel: +1-510-403-3399 Fax: +1-510-403-3184 E-mail: info@portwell.com http: //www.portwell.com 6F, Building 3, Qunying Zone, Chuangye Rd. 8, Shangdi,Haidian District, Beijing, China 100085 Tel: +86-10-82701616 Fax: +86-10-82700606 E-mail: info@portwell.com.cn http: //www.portwell.com.cn Unit 7, Holloways, Bessemer Close Ebblake Industrial Estate, Verwood, Dorset, BH31 6AZ, UK Tel: +44(0)1202-813816 Fax: +44(0)1202-813817 E-mail: info@portwell.co.uk http: //www.portwell.co.uk Laxsons House, AA2, Walbhat Road, Goregaon (E), Mumbai - 400 063, Maharashtra, India Tel: +91-22-2685-9911 Fax: +91-22-2685-9922 E-mail: info@portwelllaxsons.com http://www.portwelllaxsons.com 101-0042 ShowaKanda Build, 10-2 Kanda Higashi matsushita-cho chiyoda-ku Tokyo Japan Tel: +81-3-5298-8071 Fax: +81-3-5298-8072 E-mail: info@portwell.co.jp http: //www.portwell.co.jp

Open the catalog to page 1