Technical Information Overview

Partek produces products that are made from only the fi nest Fuoropolymers available. These Fluoropolymers are resistant to numerous chemicals and solvents. This information provides only a brief technical overview . For more comprehensive technical and chemical compatibility information, please ask for Technical Bulletin 0002-T1/USA. PTFE Modifi ed PTFE is a fl uorocarbon resin that is isostatically compression molded into various shapes and confi gurations. It is chemically resistant to all chemicals and solvents with the exception of some molten alkali metals, molten sodium hydroxide, elemental fl uorine and certain fl uorinating agents. At Partek we use PTFE for machining the bodies and components of various valves and manifolds. It offers chemical resistance and stability at high temperatures. material is used primarily for diaphragms and bellows in our products. This material has the same processing and chemically resistant characteristics as the standard product but offers superior cycle life and integrity in diaphragm products. PFA

Fluorinated Polymers

• Resistivity to corrosive agents • Low dielectric constant • Flexibility at low temperatures • Non-solubility • Low dissipation factor • Low coeffi cient of friction • Long term weatherability • High arc resistance • Stability at high temperatures • Non-adhesiveness • High surface resistance • Nonfl ammability • High volume resistivity Chemical Properties Electrical Properties Mechanical Properties is a copolymer of tetrafl uoroethylene and perfl uoroalkyl vinyl ether. The resultant polymer contains the carbon-fl uorine backbone chain typical of PTFE, but unlike PTFE, does not require special fabricating techniques. PFA pellets have good melt fl ow characteristics that allow for processing via extrusion, compression, blow, transfer and injection molding methods. It has outstanding chemical and solvent resistant characteristics over a temperature range even greater than PTFE. PFA is offered in various grades of purity and cleanliness making it the material of choice for the semiconductor market.

Cv and Kv Formulas

P ERCENT OF RATED PRESSURE VS. TEMPERATURE

P

P = Pressure Drop (PSIG)SG = Specific GravityQ = Flow (GPM)

SG

90 80 7

Q = KvQ = CvY P

P = Pressure Drop (BAR)Y = Specific Gravity (kg/cm

60

)Q = Flow (LPM)

5

1 Kv = 14.26 Cv

40

“C

” fl ow factor is the number of gallons of fl uid that pass through a given orifi ce area in one minute, at a pressure drop of 1 PSIG.“K

30

20

” fl ow factor is the number of liters of fl uid that pass through a given orifi ce area in one minute, at a pressure drop of 1 bar.For operation at temperatures above ambient conditions, please refer to the chart above for reduced pressure ratings.

3