| Low Z-axis expansion - Reduced expansion improves through-hole reliability - Excellent for high layer count assemblies - Designed to withstand multiple reflow excursions and repair operations High Tg, excellent thermal stability and moisture resistance - Improved lead-free assembly compatibility - Proven 1ST testing results - Exceptional peel strength - Suitable for high-layer count, sophisticated PWB designs CAF Resistant - Providing long term reliability in end products Proprietary resin chemistry - Extremely low Z-CTE. - Improved thermal stability, CAF and moisture resistance when compared to traditional FR-4 Superior electrical properties - Supporting advanced technology PWB designs Optimized FR-4 processing - Superior rheology providing consistent controlled flow and superior via topography. - 75 min press at 185°C and 200-300 psi And Much More - Vacuum laminated - Available in a wide variety of constructions, copper weights and glass styles including standard copper, double treat and RTFOIL® laminate. - Meets UL 94V-0 and IPC-4101/28, /98, /99 and /126 specifications* - RoHS compliant. |