catalogue search
P. 01
P. 02
|
|
You may also be interested in
Film, Resin, Prepreg, Adhesive, Epoxy resin
Text version of the page
| \dvanced Circuitry Materials | ||||||||||||||||||||||||||||
| Neleo N4000-13 EP™ Neleo N4000-13 EP™ SI® High-Speed Multifunctional Epoxy Laminate & Prepreg | ||||||||||||||||||||||||||||
| Nelco N4000-13 EP™ is an enhanced epoxy resin system engineered for today's lead-free requirements where multiple solder reflow at temperatures approaching 260°C are required. N4000-13 EP provides enhanced thermal reliability without compromising the electrical and signal loss properties that have made the Nelco N4000-13 product family the industry standard for demanding high speed / low loss designs. The N4000-13 EP™ SI is excellent for applications that require optimum signal integrity and precise impedance control, while maintaining high CAF resistance2 and thermal reliability. | ||||||||||||||||||||||||||||
| Applications - Fine-Line Multilayers - Backplanes - Surface-Mount Multilayers - BGA Multilayers - MCM-Ls - CSP Attachment - Wireless Communication Infrastructure - High Speed Services - High Speed Storage Networks - Internet Switching / Routing Systems | ||||||||||||||||||||||||||||
| Key Features | ||||||||||||||||||||||||||||
| Lead-Free Assembly Compatible - Suitable for assemblies with a maximum reflow temperature of 260°C 1 Tg >210°C, outstanding thermal, electrical and signal loss properties - Excellent thickness control for tight tolerance impedance applications - Low Df and Dk allows for low signal distortion and faster signal propagation required by high frequency (1 - 10 GHz) and high reliability applications CAF resistant 2 - The low Z-CTE and improved CAF resistance 2 provide long-term reliability for both RF and digital applications - Provides excellent CAF resistance even after multiple lead-free assembly exposures Signal Integrity and Buried Capacitance™ options - When used, SI glass provides enhanced electrical performance for even the most demanding applications - Approved ZBC-2000* substrate available for thinner, more reliable assemblies and increased board densities Proprietary advanced resin technology - Industry standard material with well documented dielectric constant and loss tangent properties High-Tg FR-4 processing - Identical processing to the Nelco N4000-13. similar to traditional high Tg FR-4 materials - 90 min press at 193°C and 275-350 psi Available in a variety of constructions - Available in a wide variety of constructions, copper weights and glass styles including standard copper, double treat and RTFOIL* - Meets UL 94V-0 and IPC-4101/29 specifications - All Nelco materials are RoHS compliant. - Vacuum laminated | ||||||||||||||||||||||||||||
| Global Availability | ||||||||||||||||||||||||||||
| Nelco, California Nelco, New York Neltec, Arizona Nelco, Asia Pacific Neltec Europe SAS Neltec, SA | + 1.714.879.4293 + 1.845.567.6200 + 1.480.967.5600 +65.6861.7117 +33.380.10.10.00 +33.562.98.52.90 | |||||||||||||||||||||||||||
| www.parkelectro.com info@parkelectro.com | ||||||||||||||||||||||||||||
| Park's UL file number: E36295 | ||||||||||||||||||||||||||||
| 1 Max suitable reflow temperature for N4000-13 EP assemblies is dependent upon design and fabrication details. | PARK 1 ELECTROCHEMICAL CORP. | |||||||||||||||||||||||||||