NPM - 4 Pages

Model ID

NPM-D

Front head

Rear head

16-nozzle head 12-nozzle head 8-nozzle head 2-nozzle head Dispensing head No head

16-nozzle head

12-nozzle head

8-nozzle head

2-nozzle head

Dispensing head

NM-EJM1D

NM-EJM1D-MD

NM-EJM1D-MD NM-EJM1D

NM-EJM1D-D

Inspection head

_ No head

PCB Dual-lane mode

dimensions*! Single-lane mode

L 50 mm x W 501

L 50 mm x W 50 [

_NM-EJM1D-MA

NM-EJM1D

L 510 mm x W 300 mm

L 510 mm x W 590 mm

PCB

exchange

time

_ NM-EJM1D-A

NM-EJM1D-D | -

Dual-lane mode Q s* *No 0s when cycle time is 4.5 s or less

Single-lane mode 4.5s

Electric source

3-phase AC 200. 220. 380. 400. 420. 480 V 2.5 kVA

Pneumatic source's

Dimensions *2

0.5 MPa, 1 00 L /min (A.N.R.)

W 835 mmx D 2 652 mm«3 x H 1 444

Mass

1 520 kg (Only for main body:This differs depending on the option configuration.)

Placement head

16-nozzle head (With Dual Heads)

12-nozzle head (With Dual Heads)

8-nozzle head (With Dual Heads)

2-nozzle head (With Dual Heads)

Placement speed Max. speed

70 OOOcph (0.051 s/chip)

62 500cph (0.058 s/chip)

40 OOOcph(0.090 s/chip)

8 500cph (0.423 s/QFP)

IPC9850(1608)

53 800cph-E

48 OOOcph-5

  

Placement accuracy(Cpkfel)

±40 A/m/chip

±40 ym/chip

±40 um/ chip

±30i/m/QFP □12mm ~ 03211111

±50ym/QFP m 2 mm Under

±30 ym/QFP

Component dimensions (mm)

(01005")0402chip«e toL6xW6xT3

(01005") 0402 ch ip -e to L12 X W12 X T 6.5

(01005") 0402 chip-e to L 32 X W 32 X T12

(0201")0603 chip to L 100 X W 90 X T 28

Component

supply

Taping

Tape : 8 / 12 / 1 6 / 24 / 32 / 44 / 56 mm

Tape:8 to56/72/88/ 104mm

8 mm tape : Max. 68 (double feeder, small real)

Stick.Tray

Stick: Max. 8, Tray: Max. 20 (per tray feeder)

Dispensing head

Dot dispensing

Draw dispensing

Dispensing speed

0.16 s/dot (Condition :XY= 10 mm, Z=less than 4 mm movement, No S rotation)

3.75 s/component (Condition: 30 mm x 30 mm corner dispensing)

Adhesive position accuracytCpte 1)

± 75 um/tiot

± 100 A/m/component

Applicable components

1608 chip to SOP.PLCC.QFP.Connector.BGA.CSP

SOP.PLCC.QFP.Connector.BGA.CSP

Inspection head

2D inspection head (A)

2D inspection head(B)

Resolution

18 um

9 um

View size

44.4 mm x 37.2 mm

21.1 mm x 17.6 mm

inspection Solder Inspection's

0.35s/ View size

Miuuubblllg

time

Component Inspection -a

0.5s/ View size

Inspection

object

Solder

Inspection's

Chip component: 100 u m x 150 u m or more (0603 / 0201" or more)

Package component: $ 150 /um or more

Chip component: 80 um x 120 um or more (0402 / 01005" or more)

Package component: $ 120 um or more

Component

Inspection's

Square chip (0603 / 0201' or more), SOP, QFP (a pitch of 0.4mm or more),

CSP, BGA.AIuminum electrolysis capacitor, Volume, Trimmer. Coil, Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more),

CSP. BGA.AIuminum electrolysis capacitor, Volume. Trimmer, Coil. Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Inspection

items

Solder Inspection's

Oozing, blur, misalignment, abnormal shape, bridging

Component Inspection's

Missing, shift, flipping, polarity, foreign object inspections

Inspection position accuracy (Cpte 1) -a

± 20 yum I ± 10 jum

No. of

inspection

Solder Inspection's

Component Inspection's

Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)

Max. 10 000 pcs./machine

* Placement tact time,inspection time and accuracy values may

differ slightly depending on conditions

*Please refer to the specification booklet for details,

*1 : As board transfer standard differ, it cannot be linked with dual-lane spec.

MPM (NM-EJM9B).

*2 : Only for main body

*3 : Dimension D including tray feeder: 2 683 mm

Dimension □ including feeder cart: 2 728 mm

*4 : Excluding monitor and signal tower

*5 : It is the reference value of the tact time by the IPC9850 conformity.

*6 : The 0402 chip requires a specific nozzle/feeder.

*7 : Foreign body inspection is available to chip components

*8 : One head cannot handle solder inspection and

component inspection at the same time.

*9 : This is the solder inspection position accuracy

measured by our reference using our glass PCB for

plane calibration. It may be affected by sudden

change of ambient temperature.

/^Safety Cautions

• Please read the User's Manual carefully to

familiarize yourself with safe and effective

usage procedures.

• To ensure safety when using this equipment all work should be

performed according to that as stated in the supplied Operating

Instructions. Read your operating instruction manual thoroughly.


 

^yfl^ Panasonic Group products are

ftrpjfff built with the environment in mind.

|JiliP' http://panasonic.net/eco/

Panasonic Group builds Environmental Management System in the

prrfl factories of the world and acquires the International Environmental

Uiiy Standard ISO 14001:2004.

inquiries-

Panasonic Factory Solutions Co., Ltd.

Corporate Sales Division

1375 Kamisukiawara, Showa-cho, Nakakoma-gun, Yamanashi 409-3895, Japan

TEL+81-55-275-9148

FAX +81-55-275-6269

All data as of December 1, 2011

Ver.December 1,2011

©Panasonic Factory Solutions Co.,Ltd.2011

►Changes in specifications and appearance may be made without notice for product improvement.

»HomePage http://panasonic.net/pfsc/

►Recycled paper is used this Catalog.

Panasonic

ideas for life

2012

Electronics Assembly System f

catalog .

PRODUCTION MODULAR

NEXT PRODUCTION MODULAR

Manufacturing Process Innovation

Model Name

NPM-D

Model No.NM-EJMW

Model No.NM—EJM1D—MD Model No.NM-EJM1D-D

Model No.NM—EJM 1D—MA Model No.NM-EJM1D-A

LNB conveyor + 3 production modulars in-line setup

C€

*lt may not conform to Machinery Directive

and EMC Directive in case of optional

configuration and custom-made specification.

NPM
  1. P. 1

  2. P. 2

    I System evolution according to mounting changes NEW; High area productivity with total mounting lines Total line solution Higher productivity...
  3. P. 3

    Higher area productivity through dual lane placement Placement Heads High productivity Employs dual mounting method Alternate.lndependent...
  4. P. 4

    NEXT PRODUCTION MODULAR Total management by system software System Software High-quality mounting A PC system Feedforward to mounting...
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