8000 Overview

Specifications Capabilities Key Features: One step planar gold bumps formed without leaving a tail; ideal for Au flip chip. Bond Type Thermosonic ball and wire bonding, ball bumping Cycle Time 0.125 sec/wire, 0.077 sec/bump Deep access capability enables wire placement into deep electronic packages. Wire Pitch 50 micron (using 20.0 micron wire) Placement Accuracy ± 2.5 micron, 3 sigma Large bonding area 12” x 6” X-Y bond area minimizes index time and improves throughput. Deep Access 0.75” tool (optional) Bond Area 12” x 6” Automated assembly of quality components results in extremely high yields and repeatable, predictable electrical performance. Motion System Resolution 0.20 micron (XY axis) Repeatability ± 2.5 micron, 3 sigma Control System Linear motor/encoder (XY) Voice coil, linear encoder (Z) The SMEMA compatible, compact design promotes efficient washing room layout in stand- alone installation or integrated into a full line. Z-axis Stroke 0.78”
Wire Spool Size(1.0 in.), double flanged spool On-screen video allows point and click selection of bond placement sites.
Wire Diameter17.8 to 44.5 micron (0.7 to 1.75 mil) Pattern Recognition Bond Data Miner professional monitors machine and process trends providing increased yields and predictive maintenance.
Vision SystemCognex 8000 series PR Theta± 7º from taught angle Capture Range~ 760-1300 micron (30-50 mils), magnification dependent Focus Range (Depth Of Focus)Programmable focus across 0.40” (focal lens floats on Z-linear axis) Available Options: Facility Requirements Vacuum 25 in. Hg Adaptive Bond Deformation Air At Bonder Inlet 60 PSIG +5, 15 SCFM This tool enables direct and uniform control of ball deformation reducing the process development time Power 200, 220, 230, or 240 VAC ± 5%, 50 or 60Hz, single phase, 30 AMP, transient-free conditioned power Stand-Off-Stitch-Bump Simple program interface enables users to define a planar bump prior to crescent bond. IC to IC or difficult to bond materials will benefit from this feature. Size and Weight 31.5” wide x 70” tall x 37.5” deep Weight 1800lbs (uncrated) The specifications are subject to change without notice Tailless Bump Mode This feature is designed specifically for flip-chip applications. It allows the formation of bumps with height consistency of +/- 2 microns (3 sigma). Inline and magazine handlers Various automated handler types and magazine loaders can be added to increase yields and throughput. Palomar Technologies Inc. 2728 Loker Avenue West Carlsbad, CA 92010 Phone 760.931.3600 Fax 760.931.5191