2 pages in the catalogue
Model 8000 Wire Bonder & Ball Bumper |
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Model 8000 Wire Bonder & Ball Bumper p 1 www.palomartechnologies.com Model 8000 Wire Bonder & Ball Bumper Applications: Large Complex Hybrids System In Packages (SIPs) Multichip Modules (MCMs) Automotive Assemblies LED’s with running ... |
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Model 8000 Wire Bonder & Ball Bumper p 2 8000 Overview Specifications Capabilities Key Features: One step planar gold bumps formed without leaving a tail; ideal for Au flip chip. Bond Type Thermosonic ball and wire bonding, ball bumping Cyc... |
