| Precise loop and wire length control. High frequency impedance matching and long low loops control package inductances; provides reduction of rework and test iterations; and allows assembly of thin profile packages. Dual-mode ultrasonics provides over 100 discrete programmable power levels for adjustment to variations in bonding surfaces, packages, and parts. Expansive X-Y robotic positioners are capable of moving the standard 16"2 (4" x 4") work stage or optional 24"2 (4" x 6") work stage over a 60"2 (5"x 12") area (2470-V). The 3470-II is capable of moving to any position within a 32.5" x 19.5 " work envelope. Large 2-in. wire spool reduces downtime for spool changeover, or an optional de-spooler controls wire tension by automatically feeding wire on demand to the bond head. |