Osborn Printed Circuit Board Processing
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• Resin Removal Pressplate Cleaning Innovative Solutions for Printed Circuit Board Processing

United States United Kingdom Offers access to new ideas, economies of scale, and new techniques to master your surface treatment and nishing needs. Servicing more than through numerous agencies and strong distribution networks. Providing insight into the customs and best practices necessary to succeed anywhere in the world.

PRINCIPLES IN MANUFACTURING AND DEVELOPING SURFACE FINISHING ROLLERS Highly competitive global markets dictate that only the fittest survive hence high reliability, stability and long durability have become a necessity. Printed Circuit Board manufacturing has changed dramatically in recent years and production processes can no longer be simply described as: deburring, cleaning or finishing. We have not only had to broaden our vocabulary but also extend and develop the range of brushing rollers used for mechanical surface processing. We have a range of brushing rollers to meet these goals,...

LIPPROX® CDR CLEAN DEBURRING ROLLER PCB made of Teflon base material. Cross-section of a bore of 0.30 mm – enlarged 500 :1. Deburred with LIPPROX and perfectly metallized. Base copper only 5–9 µm. Deburred with LIPPROX® and perfectly metallized. Cross-section of a bore of 0.50 mm – enlarged 100 :1. Base copper only 18 µm. Deburred with LIPPROX® and perfectly metallized. LIPPROX® – burr removal prior to plating Your advantages: • uniform surface quality Life comparison chart Br ush dur lt [ 2 x 1000] abii y m Despite the introduction of high speed drills, an entirely burr free hole is rarely...

LIPPRITE® SCR SUPER CUT ROLLER Direction of brush rotation Station 1 (and 3): Top roller must rotate with the board. Bottom roller must rotate with the board. Station 2 (and 4): Top roller must counter rotate. Bottom roller must counter rotate. Machine set-up for: • Removing built-up resin ink spots • Finishing for BGA process Process/Product Recommendation • Removing residual copper “nodules” after plating (surface preparation prior to lamination) Surface levelling: • Burr removal prior to plating LIPPRITE® Super Cut Roller After the black oxide process for internal via holes (IVH) and...

LIPPRITE® HFR HIGH RESOLUTION FINISHING ROLLER Stability and Durability Surface roughness on copper LIPPRITE® High Resolution Finishing Roller is enhanced by our own synthetic resin based treatment: I20. This special impregnation ensures improved cleaning performance, a better cushioning effect and longer service life. A further advantage: the Printed Circuit Boards can be processed more quickly and there is a subsequent increase in productivity. Experience On a perfectly flat surface (with no waviness included in measurements), the values should lie between Rz 1.5 – 3.0 µm. Values...

LIPPRITE® HFRBLUE HIGH RESOLUTION FINISHING ROLLER LIPPRITE® SFR SOLDERMASK FINISHING ROLLER With finer circuitry, the dry film lamination process has become very common. Dry film must adhere perfectly to the copper surface of the laminate to ensure that there is neither contact failure nor under-etching during the subsequent etching process. • Scrubbing prior to applying solder resist • uniform surface quality Solder resist is applied by screen printing or through a photolithography method. It serves as insulation to protect the surface of circuitry and prevent deterioration or solder...

LIPPRITE® PCR PRESSPLATE CLEANING ROLLER A selection of standard sizes available: Dia. [mm] Machine Type Wesero Junior / Höllmüller 45 / Schmid 450 IS Scrubbex-SHD / Wesero 600 / Schmid 600 Schmid 650 / IS Scrubbex-2000 / Höllmüller 65 / Wesero U 600-1 / Pola & Massa / Wise Pola & Massa / Wise Chemcut, Marseco TTM, Billco, Somaca, Chemcut Seiko, Marugen, IML SD-1400, Ishi Hyoki, Pioneer / Wise Billco, Marseco, Chemcut Ishii Hyoki Century, Somaca Your advantages: LIPPRITE® Pressplate Cleaning Rollers Wesero, Curtin Hebert • top brushing quality, clean surface Will remove resin that has...

Osborn Sells Solutions The Global Leader in Surface Treatment Solutions and Finishing Tools Global Headquarters North American Headquarters Osborn International GmbH Ringstrasse 10 35099 Burgwald Germany Tel.: +49 64515880 Fax: +49 6451588206 info@osborn.de Osborn 1100 Resource Drive, Suite 1 Brooklyn Heights, OH 44131-1854 USA Tel.: +1 2163611900 Fax: +1 2163611913 brushes@osborn.com Osborn International Ltda. Rua Lemos Torres, 150 - Jardim Gagliardi 09890-070 São Bernardo do Campo Brazil Tel.: +55 1143916559 Fax: +55 1143916550 osborn@osborn.com.br Osborn International Rm. 505, Tower H...