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EMI shielding, Shielding, EMI gasket, Seal, Finger-stock
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Tech FactsPlatingIn environments with high humidity, and when dissimilar metals are present, it is advised to consider the electrochemical potential between the shield gasket and the metal in contacts.To prevent galvanic action and its corrosive effects at these points of electrical contact, Omega Shielding offers a complete selection of electronic grade platings. Such surface treatment may be considered when the dissimilar metal's potential is great between the gasket and its mating surfaces, or to assure against oxidation in harsh environments. For example, shown in table below, un-plated Beryllium Copper may perform well with the metals in GROUP 2, but tin plating is recommended for use with GROUP 3Finish Code ExplanationFinish Code Finish Required-20 Bright Finish (Standard Finish) -50 Bright Gold -60 Bright Nickel -61 Matte Nickel -62 Bright Electroless Nickel -70 Semi-Bright Silver -80 Bright Tin Plate -81 Matte Tin Plate -90 Bright Zinc Plate -00 Grouping Of Common Metals By Electrochemical PotentialCATHODIC ANODIC 1. 2. 3. 4. 5.Gold Copper Tin Cadmium Magnesium Platinum Bronze Tin Lead Zinc Rhodium Brass Aluminum Galvanized Steel Graphite Beryllium Copper Carbon Steel Palladium Stainless Steel Silver Steel-400 Series Titanium Chromium Nickel Tungsten Molybdenum9 OSP Catalog V6 |
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