General - OAI - #5

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Semiconductors Precision Lithography Systems for R&D to Production Model 200 Mask Aligner System Manual, table top Contact Mask Aligner for Universities and R&D.  Flexible - fast, easy change of substrate and mask holders  Substrate sizes up to 8”  Entry level price point  Available with Near, Mid and Deep UV  Special optics and holders for small pieces and substrates  Available with optional back side IR alignment  Optional Nano Imprint Module available  Model 500 Mask Aligner System Semi-automatic Contact Mask Aligner for R&D as well as low volume production.  Integrated frame and vibration isolation  Available with Near, Mid and Deep UV  Accommodates substrate up to 8” square  Available with 9mm field objective separation for small pieces and substrates  Optional Nano Imprint Module available  Model 30 Collimated UV Lightsource Modular unit can be used as stand alone or integrated into almost any mask aligner or exposure system.  Available with Near, Mid and Deep UV  Power up to 10KW  Constant intensity and constant power mode  Excellent uniformity and collimation angle with increased intensities  High speed electronic shutters for very short, very accurate exposures are available  Pictured with optional stand  Model 5000 Mask Aligner System Fully Automated Mask Aligner System with precision automatic alignment and advanced pattern recognition.  True proximity, hard, soft and vacuum contact modes  Stores process recipes  For substrates measuring up to 300mm  Computer controlled LED microscope lighting for difficult substrate viewing conditions  Model 2000 Automated Flood and Edge Exposure System  Wafer sizes up to 8”  Computer controlled Windows® based graphic user interface software  SEMI S-2 compliant  Cassette-to-cassette robotic handling  Model 2012 300MM Edge Exposure System 300mm Exposure Systeml  8” to 300mm wafers  Automated FOUP loading  SEMI S-2 compliant Any OAI mask aligner system may be configured with an optional OAI Nano Imprint Module