General - OAI - #3

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MEMS Precision Equipment for R&D or Production Model 200IR Mask Aligner System Front and Backside IR Mask Aligner System.  Entry level price point  Flexible design for easy change of wafer and mask holder  Accommodates substrate up to 8”  PLC controlled  Filter holder and a wide range of filters available  Wafer Bonder Activate, align and bond in one system  Eliminates the need for separate aligner system  Lower temperature bonding, high bond strength, and higher yields  Anodic, silicon direct and thermal compression bond tooling available  In-situ low-temperature bonding  Model 30 Collimated UV Lightsource Modular unit can be used as a stand alone or integrated into almost any mask aligner or exposure system.  Available with Near, Mid and Deep UV  Power up to 10KW  Pictured with optional stand  Model 8000 Mask Aligner System Fully Automated Optical Front and Backside Mask Aligner.  True proximity, hard, soft and vacuum contact modes  High precision automated alignment  Flexible, modular design for substrates up to 300mm  May be retrofitted in the field from manual to fully automated system  Computer controlled LED microscope lighting for difficult substrate viewing conditions  Model 800 MBA Mask Aligner System Semi Automated Optical Mask Aligner with Front and Backside Alignment. For use in R&D and low volume production applications.  Includes anti-vibration table  Automated substrate planarization  Optical 4-camera front and backside alignment  Flexible design for fast and easy changes in wafer and mask sizes  Touch screen control of exposure time and process settings  Priced to meet most budgets  Motorized backside focus  Motorized auto-leveling and auto gap-setting  Optional chuck and Z-gap digital display  Any OAI mask aligner system may be configured with an optional OAI Nano Imprint Module