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| | | PA 60 K 7 V 35 | | |
| | | 255X25X25. | | |
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| | | | | | | | | | | | | | | | | | | | | | | '—»■-T"~"—»■—=— | | | | Type of Abrasives | Grit Size | Grade | Structure | Bond Type | Bond Symbol | Shape | Size | | | | | Coarse 8 | So | t ! | Dens 1 | | Variety of bond symbol | 1 | Straight | | | | | WA: White Aluminum Oxide | | 10 | | | | 2 | V: Vitrified | designate characteristics | 2 | Ring | Outer Diameter | | | | PA: Pink Alundum Oxide | | 12 | | J | | 3 | | of the wheel. | 5 | Recessed One Side | X | | | | SA: Mixture of Aluminum Oxide | | ; | | K | | | B: Resinoid | <Example> | 6 | Streight Cup | Thickness | | | | GA: Semi-Friable Aluminum Oxide | | i | | L | | i | | V35: Good cutting ability | 7 | Recessed two side | X | | | | CX: Ceramic Grain | | | | M | | | R: Rubber | V104: For ceramic grain | 11: | Flaring Cup | Hole Size | | | | C : Regular Silicon Carbide | | 4000 | | | | 18 | | BZ: For ball lapping | | | | | | | GC:Green Silicon Carbide | | 5000 | | | | 19 | | B80W: For needle grinding | | | | | | | RG: Zirconia | Fine 6000 | Hard Z | Open 20 | | R30: Standard rubber bond | | | | | | | | | | | | | | | | | | | | | | |
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| | | RESINOID GRINDING WHEEL | | |
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| | | WEIGHING MIXING | | |
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| | | VITRIFIED GRINDING WHEEL | | |
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| | | <Superabrasive Wheels> CB 80 M 200 V N1 1A1 350X25X127 3.0x | | |
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| | | | | | | | | | | | | | | | | | | | Type of Abrasives | Grit Size | Grade | Concentration (Vol%) | Bond Type | Bond Symbol | Shape(IDAS) | Size | X-Layer | | | | CB : CBN (Cubic Boron Niteride) | #40-32,000 | Soft J | Low 0( 0.0%) | | Variety of bond symbol | 1A1:Streight | Outer | | | | | | | | | | | V : Vitrified | designate characteristics | | Diameter | X-Layer means the | | | | CBC : Metal Coated CBN | #40-12,000 | | L | | 50(12.5%) | | of the wheel. | 1A1R:with Recess | X | thickness of CBN/ | | | | | | | N | | | B : Resinoid | | for cut-off wheel | Thickness | Diamond layer. | | | | D: Natural Diamond | #16-325 | | | P | | 100(25.0%) | | <Example> | | X | | | | | | | | | R | | | M : Metal | VN1 (Vitrified Bond) | 6A2:Disc | Hole Size | <Example> | | | | | #60~64,00( | ) | | T | | 150(37.5%) | | BW6 (Resinoid Bond) | | | 3x = 3.0mm | | | | | | | | | | | P : Plated | MH4 (Metal Bond) | | | | | | | SDC : Metal Coated | #60-700 | | | | High 200(50.0%) | | PA5 (Electro Plated) | | | | | | | Synthetic Diamond | | | Hard | | | | | | | | | | | | | | | | | | | | | | | | | | |
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| | | METAL BOND DIA/ CBN WHEEL | | |
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