RIE-1701 Anisotropic RIE Plasma System - Nordson MARCH - #1

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Plasma Chamber of RIE-1701 Plasma System (6” version) RIE-1701 Anisotropic Etch Plasma System Affordable reactive ion etching (RIE) in a compact, bench-top configuration The RIE-1701 anisotropic reactive ion etch (RIE) plasma system from Nordson MARCH is self-contained, and requires minimal bench space. The chassis, which also serves as an integrated safety enclosure, houses the plasma chamber, control electronics, 13.56 MHz RF generator, and automatic matching network. Maintenance access is provided through a front-opening door or easily removed panels. The plasma chamber is constructed of high-quality anodized aluminum with ceramic fixturing for superior durability. The plasma chamber can be configured with a 6” or 8” powered electrode to accommodate a wide range of wafer sizes, pieceparts, IC packages and other components. High performance plasma etching, from Failure Analysis to MEMS and LED device manufacturing The RIE-1701 plasma system is designed for advanced etching applications such as removal of interlayer films for failure analysis; de-encapsulation and dielectric material removal; etching of oxides, nitrides, polyimides, silicon, metal, III-V and II-VI materials for MEMS, LED, or IC device manufacturing; epoxy removal; photoresist stripping and descum. The system can accomodate a wide range of process gases, inclulding: Ar, O2, H2/forming gas, He, CF4, SF6, Cl2, and BCl3. Standard are 2 electronic mass flow controllers for optimal gas control, with 2 more available as an option (4 total). High etch rates and excellent uniformity Representative etch rates achievable in the RIE-1701 system: Al/metals: 1 micron/min. GaAs: 1 micron/min. TiW: 5,000 Å/min. Silicon/Oxide/Nitride: 3,000-7,000 Å/min. RIE-1701 advanced design features • Touch screen control and graphical user interface provides real-time process data and feedback • 13.56 MHz RF generator with automatic matching network delivers excellent process repeatability • Temperature control loop integrated into plasma chamber enables precise control run-to-run • Turbomolecular pump package and butterfly valve pressure control options available RIE-1701 Plasma System with Safety Enclosure Door Closed