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FlexTRAK-WRPlasma Processing System

FlexTRAK-WR Plasma Treatment System - 18446 March

® A NORDSON COMPANY

SUPERIOR PLASMA TECHNOLOGY FOR HIGH THROUGHPUT WAFER PROCESSING

The FlexTRAK-WR system is designed for high-throughput processing of semiconductor wafers up to 300mm (12 in.) in diameter. The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Its three-axis symmetrical chamber ensures all areas of the wafer are treated uniformly, while tight control over all process parameters ensures highly repeatable results.The universal architecture of the FlexTRAK-WR systemaccommodates a wide range of wafer sizes in the same systems, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy. APPLICATIONS Wafer processing prior to typical back-end packaging steps. Suitable for wafer-level packaging, flip chip, or traditional packaging. Wafer Cleaning

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Remove contamination prior to wafer bumping
FlexTRAK-WR 300 Plasma System

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Remove organic contamination

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HIGH THROUGHPUT PROCESSING Remove Fluorine and other halogen contamination The FlexTRAK-WR system’s integrated semiconductor wafer handling system provides rapid material transfer for a wide range of wafer sizes. Processing can be done from most types of wafer cassettes and front opening unified pods (FOUP). The patented chamber design and control architec- ture enables short plasma cycle times with very low overhead, ensuring that throughput for your application is maximized and cost of ownership is minimized.

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Remove metal and metal oxides

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Improve spun-on film adhesion

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Clean Aluminum bond pads Wafer Etching FEATURES AND BENEFITS

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Descum wafer of residual photoresist / BCB

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Pattern dielectric layers for redistribution

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Highly uniform plasma with high etch rates

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Strip / Etch photoresist

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Production-ready wafer handling

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Enhance adhesion of wafer-applied materials

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High machine autonomy

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Remove excess wafer-applied mold / epoxy

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Enhance adhesion of gold, solder bumps

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Service components accessible via front pull-out shelves

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Destress wafer to reduce breakage

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High throughput and low cost of ownership