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FlexTRAK-SHPlasma Treatment System

TM

FlexTRAK-SH Plasma Treatment System - 18446 March

® A NORDSON COMPANY

SUPERIOR PLASMA TECHNOLOGY FOR HIGH THROUGHPUT STRIP PROCESSING

APPLICATIONS Plasma processes for die attach, pre-wire bond, pre-mold and post-mold.Contamination Removal & Cleaning

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Fluorine & other halogens

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HIGH THROUGHPUT PROCESSING Metals & metal oxides The FlexTRAK-SH system’s integrated strip handling system provides rapid material transfer for a wide range of strip sizes, up to 5 strips per cycle. Processing can be done from most types of magazines and carriers. The patented chamber design and control architecture enable short plasma cycle times with very low overhead, ensuring that throughput is maximized and cost of ownership is minimized.

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Organic compoundsEtching

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Modify strip to improve die adhesion

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Modify surface of bonded die & strip to improvemold material adhesion and reduce delaminationSurface Activation FEATURES AND BENEFITS • Highly uniform plasma with maximized treatment rates

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I mprove die adhesive flow to eliminate voidsand enhance adhesion • Production-ready strip handling • High machine autonomy

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Improve mold material flow to eliminate voids and reduce wire sweep • Service components accessible via front pull-out shelves

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Improve underfill to eliminate voids, enhance adhesion, increase wicking speed and maintain uniform fillet height • High throughput and low cost of ownership The FlexTRAK-SH system is designed for high-throughputprocessing of lead-frame strips, laminate substrates, and other strip-type microelectronic components, up to 5 strips per cycle. The patented plasma chamber design provides exceptional uniformity and process repeatability. Its three- axis symmetrical chamber ensures all areas of the strip are treated uniformly, while tight control over all process parameters ensures highly repeatable results.The universal architecture of the FlexTRAK-SH systemaccommodates a wide range of strip sizes in the same system, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy.