FlexTRAK-SH Plasma Treatment System - Nordson MARCH - #1

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March® A NORDSON COMPANY SUPERIOR PLASMA TECHNOLOGY FOR HIGH THROUGHPUT STRIP PROCESSING FlexTRAK-SH Plasma Treatment System TM HIGH THROUGHPUT PROCESSING The FlexTRAK-SH system’s integrated strip handling system provides rapid material transfer for a wide range of strip sizes, up to 5 strips per cycle. Processing can be done from most types of magazines and carriers. The patented chamber design and control architecture enable short plasma cycle times with very low overhead, ensuring that throughput is maximized and cost of ownership is minimized. FEATURES AND BENEFITS • Highly uniform plasma with maximized treatment rates • Production-ready strip handling • High machine autonomy • Service components accessible via front pull-out shelves • High throughput and low cost of ownership The FlexTRAK-SH system is designed for high-throughput processing of lead-frame strips, laminate substrates, and other strip-type microelectronic components, up to 5 strips per cycle. The patented plasma chamber design provides exceptional uniformity and process repeatability. Its threeaxis symmetrical chamber ensures all areas of the strip are treated uniformly, while tight control over all process parameters ensures highly repeatable results. The universal architecture of the FlexTRAK-SH system accommodates a wide range of strip sizes in the same system, yielding unmatched production flexibility. Its small chamber volume and proprietary process control system provide short cycle times, with high machine autonomy. APPLICATIONS Plasma processes for die attach, pre-wire bond, pre-mold and post-mold. Contamination Removal & Cleaning • Fluorine & other halogens • Metals & metal oxides • Organic compounds Etching • Modify strip to improve die adhesion • Modify surface of bonded die & strip to improve mold material adhesion and reduce delamination Surface Activation • Improve die adhesive flow to eliminate voids and enhance adhesion • Improve mold material flow to eliminate voids and reduce wire sweep • Improve underfill to eliminate voids, enhance adhesion, increase wicking speed and maintain uniform fillet height