FlexTRAK-2MB Plasma Treatment System - Nordson MARCH - #1

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March® A NORDSON COMPANY DUAL LANE BOAT PROCESSING WITH MULTIPLE IN-LINE PLASMA MODULES HIGH THROUGHPUT IN-LINE PLASMA PROCESSING The FlexTRAK-2MB plasma system’s integrated boat handler provides rapid material transfer for a wide range of boat sizes, up to 2 boats per plasma cycle. Processing can be done with most types of boats, trays and flat carriers. The patented chamber design and control architecture enable short plasma cycle times, ensuring that throughput is maximized and cost of ownership is minimized. FEATURES AND BENEFITS • Unique boat “by-pass” feature optimizes productivity • Multiple in-line plasma modules increase throughput • Highly uniform plasma treatment • Production-ready dual lane boat handling • Low cost of ownership • Ideal for pre-Flip Chip underfill (FCUF) processes The FlexTRAK-2MB plasma system is designed for high throughput in-line processing of microelectronic devices held in boats, trays, or other carriers, up to 2 boats per plasma cycle. The patented plasma module provides exceptional uniformity and run-to-run process repeatability. Its advanced three axis symmetrical plasma chamber ensures highly uniform plasma treatment, and control over all process parameters ensures highly repeatable results. The FlexTRAK-2MB plasma system seamlessly integrates into your production line, while accommodating a wide range of boat sizes, yielding unmatched production flexibility. Its compact plasma chamber and proprietary process control system minimize cycle times. The system provides fully automated plasma processing via SMEMA 1.2 protocol. APPLICATIONS Plasma processes for pre-Flip Chip underfill (FCUF), pre-die attach, pre-wire bond, and pre-mold steps. Plasma Contamination Removal & Cleaning • Fluorine & other halogens • Metals & metal oxides • Organic compounds Plasma Etching • Roughen surfaces to improve adhesion and reduce delamination • Modify surfaces to increase bondability and make surfaces more wettable Surface Activation by Plasma • Improve Flip Chip underfill performance to eliminate voids, enhance adhesion, increase wicking speed, and increase fillet height uniformity • Improve adhesive flow to eliminate voids and enhance adhesion • Improve mold material flow to eliminate voids and reduce wire sweep FlexTRAK-2MB Plasma Treatment System