AP-600 Plasma Treatment System - Nordson MARCH - #1

/ 2


catalogue search
AP-600 Plasma Treatment System - Nordson MARCH
P. 01
AP-600 Plasma Treatment System - Nordson MARCH
P. 02
Pages:
AP-600 Plasma Treatment System - Nordson MARCH


See other catalogues for Nordson MARCH

Text version of the page
AP-600 Plasma System March® A NORDSON COMPANY AP-600 Bench-Top Plasma System State-of-the-art plasma treatment in a compact, bench-top configuration The AP-600 plasma system from March Plasma Systems is designed to deliver exceptionally uniform plasma cleaning and treatment with unmatched ease of operation, reliability and low cost. The AP-600 plasma system is completely self-contained, requiring minimal bench space. The system chassis houses the plasma chamber, control electronics, the 13.56 MHz RF generator, and the automatic matching network (only the vacuum pump is external to the system). Maintenance access is provided through an interlocked door or removable panels. The plasma chamber is constructed of high-quality aluminum with aluminum fixtures for superior durability. The plasma chamber has multiple (up to 7) removable and adjustable powered or grounded shelves to accommodate a wide range of piece-parts, components, and part carriers including magazines, trays, and boats. Plasma cleaning, surface activation, and adhesion improvement The AP-600 plasma system is suitable for a wide variety of plasma cleaning, surface activation and adhesion improvement applications. These capabilities are used for semiconductor manufacturing, microelectronic packaging and assembly, and by manufacturers of medical and life science devices. The AP-600 plasma system can accomodate a wide range of process gases inclulding argon, oxygen, hydrogen, helium, and fluorinated gases. The system comes standard with two (2) electronic mass flow controllers for optimal gas control, with another two (2) available as an option (4 total max.) Examples of semiconductor and microelectronic applications: • Pre-die attach for enhanced die adhesion • Pre-wire bonding for improved wire bonds • Pre-mold & encapsulation for reduced delamination • Pre-flip chip underfill (FCUF) for faster, void-free fluid flow, improved filet height and uniformity, and better adhesion of the underfill material Examples of medical and life science applications: • Stent & catheter cleaning and bonding • Enabling adhesion of non-compatible materials • Tack reduction of silicone molded parts • Increasing lubricity AP-600 Features and Benefits • Touch screen control and graphical user interface give real-time process information • Flexible shelf architecture allows processing of a wide variety of piece parts, components or carriers • 13.56 MHz RF generator with automatic matching network delivers excellent process repeatability • Convenient facility hook-ups for periodic calibration requirements used in validation processes

pageCatalog pdf di En 2012-05-22-31