Group: NIKON GROUP
Catalog excerpts
SEE MORE WITH X.TRACT X.Tract provides CT-quality inspection results of complex, multilayer electronics assemblies without slicing the board. In a rapid and user friendly process, it creates virtual microsections in any direction in the region-of-interest. X.Tract reveals defects that are obscured in 2D X-ray images of layered components. The new X.Tract tool provides, fully automated acquisition, powerful image processing and detailed reporting. With X.Tract, users gain better insight into complex packages such as Package on Package (PoP) or dual-layered boards leading to reduced false call rates and higher productivity. View in detail any virtual slice in any direction in an easy non-destructive process • Identify defects with ease from complex multi-layer boards • Travel through a component by viewing 2D slices from any direction, enabling isolated clear views. • Works for small and large boards and assemblies • Automated, fast acquisition and view within minutes • Available on XT V 160 systems NIKON METROLOGY I VISION BEYOND PRECISION X.Tract enables to isolate and inspect a component in a complex package
Open the catalog to page 1INSPECT FURTHER WITH X.TRACT How X.Tract works Applications • Create virtual 3D micro sections of any region without slicing the board • Analyze multi-layer boards where 2D X-ray could obscure defects • Inspect complex packages such as BGA, PoP, CSP, QFN, LGA etc. • Isolate views for individual sides of a board which would normally show both board sides under 2D X-ray • Determine size and position of voids at joint interfaces or bulk solder • Easily identify hard-to-see defects such as Head-on-Pillow (HoP), open joints and cracks • Isolate views of the different layers within multi-layer...
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