Molded Chip Wirewound Inductors - NIC Components - #1

/ 12


catalogue search
Molded Chip Wirewound Inductors - NIC Components
P. 01
Molded Chip Wirewound Inductors - NIC Components
P. 02
Molded Chip Wirewound Inductors - NIC Components
P. 03
Molded Chip Wirewound Inductors - NIC Components
P. 04
Molded Chip Wirewound Inductors - NIC Components
P. 05
Molded Chip Wirewound Inductors - NIC Components
P. 06
Molded Chip Wirewound Inductors - NIC Components
P. 07
Molded Chip Wirewound Inductors - NIC Components
P. 08
Molded Chip Wirewound Inductors - NIC Components
P. 09
Molded Chip Wirewound Inductors - NIC Components
P. 10
Molded Chip Wirewound Inductors - NIC Components
P. 11
Molded Chip Wirewound Inductors - NIC Components
P. 12
Pages:
Molded Chip Wirewound Inductors - NIC Components


See other catalogues for NIC Components

Text version of the page
Molded Chip Wirewoun
NIN Series
FEATURES
• EIA SIZES A (1210), B (1812), C (1008) AND D (0805)
RoHS Compliant
includes all homogeneous materials
• EXCELLENT HIGH Q AND HIGH SRF CHARACTERISTICS
• BOTH FLOW AND REFLOW SOLDERING APPLICABLE
*See Part Number System for Details
• HIGH INDUCTANCE AVAILABLE IN SMALL SIZE
• EMBOSSED PLASTIC TAPE PACKAGE FOR AUTOMATIC PICK-PLACE
AVAILABLE TYPE AND RANGE
EIA Size
Size Code
Size (L x W x H mm)
NIC Type
Inductance Range
Style
0805
D
2.0 x 1.25 x 1.25
NIN-ND
10nH ~ 1.0|xH
Standard
1008
C
2.5 x 2.0 x 1.6
NIN-FC
0.22 ~ 100|xH
Standard
NIN-NC
10nH ~ 0.82|xH
High Frequency
NIN-PC
1.0 ~ 33|xH
High Curret
1210
A
3.2 x 2.5 x 2.2
NIN-FA
0.22 ~ 220|xH
Standard
NIN-NA
47nH ~ 8.2|xH
High Frequency
NIN-PA
1.0 ~ 330|xH
High Current
1812
B
4.5 x 3.2 x 3.2
NIN-FB
0.1 ~ 1000|xH
Standard
SPECIFICATIONS
Specifications
Case Size
0805
1008
1210
1812
Inductance Range
10nH ~ 1.0|xH
10nH ~ 100|xH
47nH ~ 330|xH
0.10|xH ~ 1000|xH
Inductance Tolerance
±10% (K), ±5% (J)
±20% (M), ±10% (K), ±5% (J)
±10% (K), ±5% (J)
Operating Temperature Range
-25°C ~ +85°C (at 100% of rated voltage)
Insulation Resistance
1,000 MegOhm Min. (@ 100Vdc, Termination to Case)
Withstanding Voltage
250Vdc for 1 minute (Termination to Case)
Q Factor, Self Resonant Frequency, DC Resistance, Rated DC Current and Inductance Tolerance
See Individual Product Listings
ENVIRONMENTAL CHARACTERISTICS
Test
Specification
Test Method & Condition
Solderability
90% Min. Coverage
After 3 Sec. Dip in +230C Solder Pot (Post Flux)
Humidity
(1) No Evidence of Damage (2) Inductance Shall Be Within ±5% of Initial Value (3) Q Factor Shall Be Within ±10% of Initial Value
After 500 Hrs at +60C and 90~95% RH
Soldering Effect
After 5 Sec. at +260C (5 min. 120C Pre-Heat)
Low Frequency Vibration
After 2 Hrs per Axis, 10 ~ 55Hz, 1.5mm Amplitude
Thermal Shock
After 100 Cycles (-40C ~ +85C) 30 Min. Each
Low Temperature Storage
After 500 Hrs at -40°C
High Temperature Load Life
(1) No Evidence of Damage (2) Inductance Shall Be Within ±10% of Initial Value (3) Q Factor Shall Be Within ±10% of Initial Value
After 500 Hrs. at +85C with Rated DC Current
Humidity Load Life
After 500 Hrs at +60°C with 90~95% RH at Rated DC Current
lie
NIC COMPONENTS CORP. www.niccomp.com I www.lowESR.com I www.RFpassives.com I www.SMTmagnetics.com 27

pageCatalog pdf di En 2012-05-22-31