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EzLaze Laser Cutting System

for Semiconductor Failure Analysis and LCD Repair Applications

Cutting Metal Traces Removing passivation, oxide and metal layers Removing ITO shorts

Features

Air-cooled architecture - No cooling water - Compact, Lightweight - No maintenance required Selectable wavelengths allow cutting and machining of a wide range of materials: - 1064 nm, 532 nm, 355 nm or 266 nm 3-axis control of cut size and orientation. From 2µm x 2µm (with 100X objective) to 50µm x 50µm (with 50X objective). Rotation through 180°. Simple operation via remote control box with a 6.5cm x 7.5cm LCD screen displaying menu- based commands or via RS232 interface. Precise energy control over a wide range. Internal LED spot marker. Compatible with most major brands of FA microscopes (Mitutoyo, Motic, Seiwa). 3 Operating modes: - Single shot - Continuous (1 Hz) - Burst (max. of 10 sec. at 5 Hz.)

EzLaze 3 shown with power supply and remote control. Microscope, stage and stand are options.

Wavelengths Recommended for Cutting Common Materials

Standard Configuration includes Laser Head Standard Energy

IR (1064nm) Green (532nm) UV3 (355nm) UV4 (266nm)

XY Shutter (Std. Resolution) Power Supply

Aluminum Copper Polyimide Polyimide

Remote Control 2.4m umbilical

Gold Kapton Kapton

Video spot marker Foot switch Options High Pulse Energy Rotating Shutter

Poly Silicon Silicon Silicon

1

Aluminum Nitride Nitride

High Resolution Shutter Motorized Polarizer

Silicon Dioxide SOG SOG

Horizontal Mount Laser Head with Robot-length

Silicon Dioxide Silicon Dioxide

Umbilical Internal Spot Marker
2 Microscope & Accessories

U.S. Patent #. 5,611,946, 5,811,751, 5,963,364, 5,703,713 Japan Patent #. 3026362