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QuikLaze 50ST2

Laser Cutting Solution

A precise Laser Cutting Solution for the LCD Repair, Failure Analysis, and Micro-machining market. Applications

QuikLaze 50ST2 is a tool designed specifically for quick, easy removal of a variety of materials. Multiple, user se-lectable wavelengths provide the capability to selectively remove certain materials while leaving others unaffected. A few examples of procedures that can be efficiently per-formed include: Remove ITO shorts—cut metal traces on LCD panels Remove polyimide prior to FIB edits
QuikLaze50ST2 shown with motorized micromachining accessory kit.

Q

uikLaze is an excellent tool for increased pro-ductivity in LCD repair, semiconductor failure analysis, and light micromachining applications. QuikLaze can dramatically improve the produc-tivity of IC design engineers and failure analysts by providing a valuable tool for quickly removing passivation materials and cutting circuit lines. The system can vastly improve yield for LCD production by quickly repairing defects and re-moving shorts. The QuikLaze laser system features New Wave’s latest Advanced Beam Delivery System (ABDS). The ABDS enables precise cuts on a microscopic level for each of the three wave- length regions (infrared, visible or ultraviolet). The system also provides precise power control of the wavelength selectable beam without sac-rificing the beam characteristics.

IR Energy used to make a 15 x 110 um cut in an Indium Tin Oxide line (left image). UV used for polyimide removal of a 40 um x 40 um area (right image).

Benefits

Precise cutting on a microscopic level. Fast throughput using selectable repetition rates from single shot to 50 Hz continuous. Compact laser-head design for mounting on a micro-scope or on high-volume production equipment. Cutting of assorted materials with variable wave-length (1064nm, 532nm, 355nm, and/or 266nm) con- figurations. Accurate cutting control with the standard motorized X-Y aperture. Simple operation via intuitive microprocessor-based, remote-control panel, or through an RS232 interface. Versatile software that allows precise control of ma-chining. Ease of installation and operation
U.S. Patent #. 5,611,946, 5,811,751, 5,963,364, 5,703,713 Japan Patent #. 3026362