Group: NETZSCH
Catalog excerpts
Thermal Analysis for Polymers Focus on olume tion V plica The significance of thermal analysis in polymer technology has clearly risen internationally over the past twenty years. In particular, DSC (Differential Scanning Calorimetry) has long been successfully applied in routine testing of goods received, quality control and quality assurance at injection molding and extrusion plants. In the rubber industry, quantitative analysis of rubber by means of TGA Thermogravimetric Analysis) and verification of vulcanization using DSC are becoming increasingly important. The curing of thermosets is investigated with DSC, aided by reaction kinetics. DMA Dynamic Mechanical Analysis) and TMA (Thermomechanical Analysis) are used more and more frequently, especially with composite materials and in blend technology. In literature, thermal analysis has always been treated almost exclusively in isolation. In the applications volume “Focus on: Thermal Analysis for Polymers”, released in 1998 in cooperation with the Department of Plastics and Rubber Engineering of the Würzburg-Schweinfurt-Aschaffenburg / University of Applied Sciences, practical industrial topics are used to explain correlations between thermoanalytical measurement techniques and conventional test methods used in mechanics, physical chemistry and process technology. In addition, examples are presented dealing with material and component development. The signifcance of thermal analysis as a quick, economical test method is emphasized. Thermal Analysis for Polymers Authors H. Möhler S. Knappe NETZSCH-Gerätebau GmbH Wittelsbacherstraße 42 95100 Selb Germany Tel.: +49 9287 881-0 Fax: +49 9287 881 505 at@netzsch.com www.netzsch.com
Open the catalog to page 1Please send your order to fax: +49 9287 881-505 I would like to order „Focus on: Thermal Analysis for Polymers" Name Department City/Post Code Phone Telefax NETZSCH-Geratebau GmbH VAT-No. e-mail Date, Signature *+ VAT and shipping. You will receive an invoice with delivery of the goods.
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