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Packaging Solutions

For More Information

National Semiconductor provides a comprehensive set of support services. Product information, including sales literature and technical assistance, is available through National’s Customer Support Centers. For samples, evaluation boards, datasheets, and online design tools, visit: power.national.com

Packaging

Power supply designs that push the limits of size, performance, and cost, need careful thermal considerations to keep the device junction temperature within the limits specified in the device datasheet. The difference between the ambient and the device junction temperature is determined not only by the thermal resistance of a package and the power consumed by the device, but also by the system thermal design including the PCB layout and heat distribution mechanisms such as heat sinks and airflow.Shown below is a sample of National’s portfolio of packaging options including chip scale and thermally enhanced packages. For package thermal resistance and maximum tolerable junction temperature refer to device data sheet. Visit

Americas Email: new.feedback@nsc.comPhone: 1-800-272-9959 Europe Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.comPhone: Deutsch + 49 (0) 69 9508 6208 English + 44 (0) 870 24 0 2171 Français + 33 (0) 1 41 91 87 90 Asia Pacific

www.national.com/packaging for additional packaging information.

Email: ap.support@nsc.com Japan Email: jpn.feedback@nsc.com
® Leadless LeadframePackage (LLP

National’s LLP package provides excellent power dissipation capability in a very small footprint.

® National Semiconductor 2900 Semiconductor DriveSanta Clara, CA 950511 800 272 9959 ) Mailing address: Laminate CSP-32 micro SMD MSOP (Mini 8-lead) PSOP-8
(Small and large bump) PO Box 58090 Santa Clara, CA 95052 SC-70 SO SOT-223 SOT-23 Visit our website at: www.national.com
(Small outlinemolded/ceramic) (Power surface mount) For more information, send email to: new.feedback@nsc.com TO-220 TO-263 TO-252 TO-92
(Power surface mount) (DPAK) TSSOP eTSSOP MDIP
(Molded dual-in-line package) © National Semiconductor Corporation, September 2006. National Semiconductor, , LLP, WEBENCH, Analog University, TRI-STATE, and SIMPLE SWITCHER are registered trademarks of National Semiconductor. PowerWise is a trademark of National Semiconductor Corporation. All rights reserved. 570649-006