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Worldwide Design Centers and Manufacturing Facilities

Design Centers Manufacturing Facilities

Design Centers Manufacturing Facilities

USA: EUROPE: ASIA: Wafer (Die) Fabrication:
Arlington, TexasCalabasas, California Chandler, Arizona Federal Way, Washington Fort Collins, Colorado Grass Valley, California Indianapolis, Indiana Longmont, Colorado Norcross, Georgia Phoenix, Arizona Rochester, New York Salem, New Hampshire San Diego, California Santa Clara, California South Portland, Maine Tucson, Arizona Delft, Netherlands Fürstenfeldbruck, Germany Bangalore, India Hangzhou, China (joint with Zhejiang University) Hong Kong, China Tokyo, Japan Arlington, Texas USA South Portland, Maine USA Greenock, Scotland Unterhaching, Germany Unterhaching, Germany Greenock, Scotland Kemi, Finland Milan, Italy Oulu, Finland Tallinn, Estonia Chip Test and Assembly:
Melaka, Malaysia Suzhou, China Japan Headquarters Beside KIBA 2-17-16Kiba, Koto-kuTokyo, 135-0042, Japan +81 3 5639 7300jpn.feedback@nsc.com Asia Pacifi c Headquarters 2501 Miramar Tower 1 Kimberley RoadTsimshatsui, KowloonHong Kong +852 2737 1800ap.support@nsc.com European Headquarters Livry-Gargan-Str. 10 82256 FürstenfeldbruckGermany +49 8141 35 0europe.support@nsc.com Mailing Address: PO Box 58090 Santa Clara, CA 95052support@nsc.com World Headquarters 2900 Semiconductor DriveSanta Clara, CA 95051USA +1 408 721 5000www.national.com
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