Moldflow Plastics Insight
®
X
Design Validation and Optimization MPI Features
Moldflow Plastics Insight (MPI
®
) is a comprehensive suite of software tools for simulating, analyzing, optimizing, and validating plastics part and mold designs. Powerful and easy to use, MPI offers a state-of-the-art solution that can be used to simulate nine unique molding processes, and is currently used by top manufacturers in the automotive, medical, consumer, electronics and packaging industries. Thermoplastics Injection Molding processes:
Y Insert overmolding Y Two-shot sequential overmolding Y Hot runner systems Y Dynamic Feed
® systems
The Benefits of Predictive Analysis
Y Gas-assisted injection molding Y Co-injection molding To avoid high costs and time delays when problems are discovered during manufacturing, we must uncover the effect of material, part geometry, mold design and processing conditions on the manufacturability of a part. Using predictive analysis tools to simulate the injection molding process, MPI users can evaluate and optimize interactions among these variables before production begins, minimizing time and expense. With MPI, you can simulate the filling, packing and cooling phases of thermoplastics molding processes using materials with or without fillers and fiber reinforcements, as well as predict post-molding phenomena such as part warpage. You can also simulate material flow and cure of reactive molding processes.MPI also offers a material database (the world’s largest) of more than 7,800 thermoplastic and thermoset materials, all characterized for use in plastics CAE analysis, in addition to detailed information on coolants, mold materials, and analysis capabilities of leading brands and models of molding machines. MPI is widely acclaimed for its speed and accuracy and addresses the broadest range of design geometry types and manufacturing issues associated with plastics molding processes. Y Injection-compression molding Y Microcellular (MuCell
® ) injection molding
Reactive processes:
Y Thermoset injection molding Y RTM/SRIM processes Y Microchip encapsulation Y Underfill encapsulation
New Features in version 6.0:
Y Enhanced user interface to improve efficiency and productivity Y New and expanded product integration with industry standard FEA products as well as Moldflow manufacturing solutions Y 3D solutions that are faster, more accurate and increased capacity Y More informative results from warpage, cooling, overmolding, core shift, etc. analyses
Buy Only the Modules You Need
Nineteen separate modules allows you to maximize your investment, so you can focus on plastic flow, molding process, structural integrity, or reactive molding simulations, according to your needs. Moldflow offers superior customer service, training and technical support should you need it. Y Streamlined diagnostic and communication tools including Moldflow Communicator™
MPI Users
The Best Gets Even Better
Y 60% of Fortune 500 manufacturers Version 6.0 delivers new technologies and key enhancements that help users work more efficiently, significantly reduce solution time, interact better with CAD, structural analysis and other Moldflow applications, and better understand and communicate analysis results. Y Companies in 39 countries Y Automotive, Medical, Consumer products Electronics and Packaging industries
DESIGN ANALYSIS SOLUTIONS
