| | | 17TD Three Dimensional Thermode The TD (three-dimensional) family is a new range of thermodes designed to give optimum performance in the production environment. Superior thermode design is key to process quality and consistency. Use of advanced material technology combined with highly accurate manufacturing techniques has produced a thermode with outstanding consistency of heat transfer to the parts. Precision design has resulted in a complete range of thermodes to suit every application. Key performance criteria: • Uniform temperature distribution across thermode face. • Optimal flatness under heating. • No voltage potential which may damage sensitive components. • Fastest heating and cooling rates to deliver short process times. | | Thermo-Plane Thermodes Thermoplane thermodes are specially designed by Unitek EAPRO for ultra-fast heating and cooling cycles, minimizing process times. Forced air-cooling further speeds the bonding process. Thermodes are designed to maintain co-planarity and withstand the deformation that can result from the high forces that may be necessary in the bonding process. The Thermo-Plane Thermode eliminates voltage drop as current flows through the Thermode from front-to-back instead of left-to-right, preventing damage to the parts when soldering. 69T 50 20 ~i— ~T~ ~r Thermode Thermode Thermode Family Width Length | | |
| | | • Application - Reflow solder voltage sensitive components using fold-up thermode. Maximum gradient across the tip is .050 volts. • Face sizes range from 0.25 to 1.00 inches wide. • Nichrome alloy construction maintains flatness at operating temperature. • Rigid copper holders ensure uniform heat and voltage across the tip. • Welded construction for long life. • Limited to reflow soldering at set point temperatures under 350°C. • J type thermode (K & E Optional) | | |