Minco provides critical design and manufacturing expertise for critical applications

From the extremes of land, air and sea combat environments, to deep space missions, to security checkpoints, Minco ex circuits, heaters and sensors prove themselves in the toughest conditions anywhere.

A history of building high reliability components

Minco began designing and manufacturing temperature sensors for aerospace guidance systems 50 years ago. We pioneered the development of Thermofoil™ heaters – now a standard component in modern instrumentation. Minco contin- ues to build highly reliable and rugged components that survive the harshest conditions and industrial still work when you need them to – whether it is every two seconds or once every two years.

Uniquely qualied for all custom demands

Minco is uniquely qualied to respond to industry demands for lighter, faster and smaller products. We’ve leveraged decades of design experience, state-of-the-art technology and proprietary manufacturing capabilities to build components using materials ideally suited to the temperature range, mounting requirements and space restrictions of your application. Minco’s custom capabilities can improve product life-time, reliabil- ity and even reduce costs. Minco’s reputation for nding the best solution has earned us the opportunity to provide high performance components to OEM’s around the world.

Flex Circuits

Minco’s precision ex circuitry allows us to specialize in ne lines, tight tolerances, and the exacting quality requirements needed for today’s high density, high reliability electronics. Flexible three dimensional packaging – Flex circuits oer unlimited freedom of packing geometry while retaining the precision, density and repeatability of printed circuits.
Fine lines up to 0.002” for conductors and spaces provide higher interconnect density which allows more signals to t into smaller places. Combine the space and weight savings of surface mounting and of ex circuits for the ultimate in high-density packaging. Improved vibration resistance – Under intense, broad-spectrum vibration and/or high g-forces of acceleration, the low mass of ex circuits reduces internal stresses at solder joints. Minco uses high ductility RA copper that allows for tighter bend radii without impacting reliability. Compact, low mass packaging – Flex circuits can reduce space and weight by up to 75% for optimal packaging eciency. Improved connection reliability – Eliminate wire routing errors and reduce testing time, rework and rejects by using ex interconnects that only t one way. Higher current density – Flat foil conductors of ex circuits dissipate heat better than round wires of the same cross-sectional area.
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