| | | | | | | | | | | | | | | | | | | | | | | | | | |
| | | |
| | | Design Guidelines Circuit types Single-layer • IPC 6013, MIL-P-50884 - Type 1 | | |
| | | |
| | | One conductive layer, either bonded between two insulating layers or uncovered on one side. Access holes to conductors may be on either one or both sides. Access holes on both sides of a single-layer are more expensive since the substrate must be drilled or punched separately. Stiffeners, pins, connectors, components, are optional. | | |
| | | Substrate | | |
| | | |
| | | |
| | | Double-layer • IPC 6013, MIL-P-50884 - Type 2 • Two conductive layers with an insulating layer between; outer layers may have covers or exposed pads. • Plated through-holes provide connection between layers. • Access holes or exposed pads without covers may be on either or both sides; vias can be covered on both sides. • Stiffeners, pins, connectors, components are optional. | | |
| | | Access Hole Polyimide Cover Adhesive Copper Pad Polyimide Cover Copper-Plated Through-Hole Polyimide Substrate | | |
| | | |
| | | |
| | | Multilayer • IPC 6013, MIL-P-50884 - Type 3 • Three or more flexible conductive layers with flexible insulating layers between each one; outer layers may have covers or exposed pads. • Plated through-holes provide connection between layers. • Access holes or exposed pads without covers may be on either or both sides. • Vias can be blind or buried. • Stiffeners, pins, connectors, components are optional. | | |
| | | Access Hole Cover Copper Pad Polyimide Substrate Bond Ply Polyimide Substrate Adhesive Cover Copper-Plated Through-Hole | | |
| | | |
| | | |
| | | Multilayer, not plated through-holes • IPC 6013, MIL-P-50884 - Type 5 • Two or more conductive layers with insulating layers between each one; outer layers may have covers or exposed pads. • Through-holes are not plated. • Access holes or exposed pads without covers may be on either or both sides. • Stiffeners, pins, and connectors are optional. | | |
| | | Access Hole Cover** Adhesive* | | |
| | | |
| | | Cover** Copper Pad (Layer #2) Copper Pad (Layer #1) | | |
| | | |
| | | |
| | | Polyimide Substrate | | |
| | | |
| | | * Adhesiveless base material also available **Cover may be replaced by photo-imagable coverlay (PIC) | | |
| | | |
| | | 8 | | |
| | | |
| | | | | | | | | | | | | | | | | | | | | | | | | | |