Minco’s General Capabilities

TestingMarking

When specifying testing, consider your needs carefully. Over-specification can greatly increase circuit cost. Minco encourages electrical testing. It is required on all multilayer, rigid-flex, and factory-formed circuits that are fabricated to MIL-P 50884, and certain classes of IPC-6013.See the table below for information on Minco’s test capabilities.Minco can meet your marking requirements. Our legend industrial marking system offers silkscreen-like printing usinga durable white ink that meets IPC-TM-650 industry standards. This system allows us to incorporate date code and serial num- bering, along with panel based marking, at the same time. We can also offer traditional epoxy ink hand stamp or silkscreenprinting if an alternate color or legacy specification is required. Etched marking within the part is also an option. Stiffeners andcovers may be marked with component mounting locations. Minco c a n t es t for… R a n ge of op e r a tion IPC-6013MIL-P-50884 conformance N.A. Complete dimensions Resolution: 4 decimal places Accuracy: 0.001”(0.025mm) + 0.008% of linear distance Dielectric withstanding Up to 6000 V Electrical continuity 1 to 10 k ; suggest 5 Stimulus: 0.01 V to 5.0 V Ionic cleanliness .5 microgram/square cm NACL equivalent Insulation resistance 10 k to 100 M at 10 V to 250 VDCSuggest 100 M at 100 VDC Thermal shock -70 to 200°C Moisture resistance Up to 98% relative humidity Plating thickness Down to 0.000001" (0.02µm) Flexibility 0 to 999,999 flexes Microsections Viewed at up to 1000×

Controlling impedance and electrical noise

Predictable electrical characteristics make flex circuits an idealchoice for high-speed signal transmission. Uniform spacing between conductors and grounds, continuous shield layers, and repeatable geometries are features that help control impedance and reduce crosstalk. And with flex circuits, you caneliminate connectors and other transitions that contribute tosignal attenuation. Minco can provide tight tolerances on line width, spacing, anddistance to ground layers in order to meet your impedancerequirements. Actual impedance will also depend on the circuit’sshape after installation.Contact Minco for advice on designing circuits to specificelectrical characteristics. •Microstrip - a single ground plane beneath the signal lines.•Stripline - dual ground layers above and below the signallines.•Edge coupled differential pairs – traces are adjacent to eachother in the same plane with tightly controlled width and spacing, ground plane optional.•Rigid-flex/stiffened flex circuits with uninterrupted groundlayers.•Silver epoxy coating. Silver epoxy is applied to the outside ofcircuits and electrically connected to other layers via access holes in the cover coat. Silver epoxy shielding is more flexible than copper. Signa l Ground
GroundSignalGround SignalGround 11