Minco’s General Capabilities
Standard specifications
Phy s ic al prop e rti es Surf a c e fini s h ( p la tin g)
Circuit s iz e / s t a nd a rd p a n el s iz e: 10.5 × 22" max./12 × 24", 16.5 × 22" max./18 × 24", 267 x 559mm max./305 x 610mm, 419 x 559mm max./457 x 610mm P la tin g m e thod s: Panel, selective, thruhole, blind via, buried via L a y e r s: 16 maximum. P la tin g m a t e ri als: Solder, hard gold, soft gold, tin, nickel, elec-troless nickel with immersion gold (ENIG), OSP Conductor width/ s p a c e: 0.0015”(0.038mm) minimum /0.0015”(0.038mm) minimum.
E le ctric al ch a r a ct e ri s tic s
Ho le di a m e t e r ( p la t e d ): 0.002”(0.051mm) minimum. In s u la tion r es i s t a nc e: 100 M minimum @ 25°C (77°F), assuming 0.010" (0.25mm) minimum conductor spacing. A s p e ct r a tio ( r a tio of ho le d e pth/ho le di a m e t e r ): 12:1 maximum. Di ele ctric ( typic al): 1000VRMS @ 60Hz for 30seconds, 1mAmaximum leakage current. Out l in e dim e n s ion s a nd ho le -to- b ord e r to le r a nc Access: Minco Sales and Support at763.571.3121 to ask about factory forming. Shi el d la y e r s: Solid or grid patterns; copper foil or screenedconductive ink. C l u s t e r-to-c l u s t e r to le r a nc e: e: T 0.002”(0.05mm) + 0.1% linear distance SRD:0.015”(0.38mm) + 0.1% linear distance
Laser/Hard tool:0.003”(0.08mm) + 0.1% linear distance
CMD:0.010”(0.25mm) + 0.1% linear distance e mp e r a tur e: -65 to 150°C (-85 to 302°F).Will withstand a 5-second solder immersion at 260°C (500°F)
without blistering, delaminating, or discoloring. Inductor/Ant H ea t e r s /T e mp e e nn r a a tur coi e ls: se n Specify inductance (10mH to 30mH,typical). Wire-wound coils may be integrated into the circuit.
The cover encapsulates the coil, conductors, and coil connec-
tions. For details, see Flex-Coils™- Technical Specification FC01
at www.minco.com/flex/. s or s: Minco is a leading manufactur-er of
industrial temperature sensors and Thermofoil™
flexible heaters. We
have the unique ability to integrate these components and a
flex circuit into a single package, drastically reducing assembly
time and potential errors. Call Minco to discuss your applica-
tion, or visit www.minco.com. Ch B e nd r e mic a al diu r es s ( i f s le t a xi nc b e: i l ity No detrimental loss of physical propertieswhen immersed for 15 minutes in acetone, methyl alcohol,
toluene, or trichloroethylene. ): Single-layer:6 × circuit thickness (minimum)
Double-layer:12 × circuit thickness (minimum)
Multilayer:24 × circuit thickness (minimum)
Circuit thickness is approximately 0.006" (0.15mm) per layer.
Sharper, permanent bends are common for bend-to-install
applications. Call
V al u e a dd e d asse m bl i es **
Conn Fin Pin ge Supported:0.006" (0.15mm) minimum, center-to-center;
Unsupported: 0.020" (0.50mm) minimum, center-to-center.
In-line or right angle. s: e r s: ctor s: Clincher:0.100" (2.54mm) minimum, center-to-center;
Micro series:0.050" (1.27mm) minimum, center-to-center;
Nano series:0.025" (0.63mm) minimum, center-to-center.
Optional epoxy potting is available. Swaged/soldered:0.085" (2.15mm) min., center-to-center; 0.100" (2.54mm) typical;Brazed:0.035" (0.89mm) min., center-to-center. Acti ve Compon e nt s: Pick-and-place, Hand solder or braze
Surface mount, through hole, embedded
M a t e ri als
Co ve r/ s u bs tr a t e: Polyimide film: 1 mil (25µm) * , 2 mil (50µm) * , 3 mil (75µm), 5 mil (125µm); Photoimageable Coverlay (PIC);
Epoxy glass or polyimide glass (rigid-flex) Conductor Adh es i ve: : Acrylic * , 1 oz. (35µm) * , flame retardant, epoxy, epoxy prepreg,polyimide prepreg, phenolic * , 2 oz. (71µm), 3 oz. (107µm)Cupronickel: 0.625 mil (15µm), 0.9 mil (22µm), 1.3 mil (33µm),
1.9 mil (48µm), 2.3 mil (58µm)
Nickel: 2 mil (50µm), 5 mil (125µm) Copper: 1/8 oz. (5µm), 1/4 oz. (9µm), 1/3 oz. (12µm),
1/2 oz. (18µm) Stiff e n e r : Epoxy-glass (FR-4), polyimide-glass, polyimide, cop-per, aluminum.
** See pages 20 – 22 for more information on incorporating these assem-blies into your design. Qu al ity m a n age m e nt
Minco is certified to ISO 9001: 2000 / AS/EN/SJAC9100 quality system requirements 10
* These are the most common materials used for manufacturing flex circuitsfor maximum flexibility. See page 19 or contact Minco for materials not list-
ed or special considerations (e.g. implantable devices, extended temperature
range, etc.) All specifications subject to change.