LIN J2602 Transceiver - Microchip Technology - #1

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„¶ 2010 Microchip Technology Inc. DS22230C-page 1 MCP2003/4 Features • The MCP2003 and MCP2004 are compliant with LIN Bus Specifications 1.3, 2.0 and 2.1 and are compliant to SAE J2602 • Support Baud Rates up to 20 Kbaudƒnwith LIN-compatible output driver • 43V load dump protected • Very low EMI meets stringent OEM requirements • Very high ESD immunity: - >20kV on VBB (IEC 61000-4-2) - >14kV on LBUS (IEC 61000-4-2) • Very high immunity to RF disturbances meets stringent OEM requirements • Wide supply voltage, 6.0V-27.0V continuous • Extended Temperature Range: -40 to +125°C • Interface to PIC® MCU EUSART and standard USARTs • Local Interconnect Network (LIN) bus pin: - Internal pull-up resistor and diode - Protected against battery shorts - Protected against loss of ground - High current drive • Automatic thermal shutdown • Low-power mode: - Receiver monitoring bus and transmitter off, (ƒ° 5 ìA) Description This device provides a bidirectional, half-duplex communication physical interface to automotive and industrial LIN systems to meet the LIN bus specification Revision 2.1 and SAE J2602. The device is short circuit and overtemperature protected by internal circuitry. The device has been specifically designed to operate in the automotive operating environment and will survive all specified transient conditions while meeting all of the stringent quiescent current requirements. MCP200X family members: • 8-pin PDIP, DFN and SOIC packages: - MCP2003, LIN-compatible driver, with WAKE pins - MCP2004, LIN-compatible driver, with FAULT/TXE pins Package Types MCP2004 PDIP, SOIC FAULT/TXE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS RXD VREN MCP2003 PDIP, SOIC WAKE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS RXD VREN MCP2003 4x4 DFN* WAKE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS RXD VREN EP 9 MCP2004 4x4 DFN* FAULT/TXE CS TXD VBB LBUS 1 2 3 4 8 7 6 5 VSS RXD VREN EP 9 * Includes Exposed Thermal Pad (EP); see Table 1-1. LIN J2602 Transceiver