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CRR Series MEDER electronic

SPST Reed Relays

DESCRIPTION

μ V typical thermal offset. Measuring only 8.6 mm x 4.4 mm x 3.4 mm, the leadless design eliminates skewing of leads and co-planarity issues. Insulation resistance typical to all points is >10 The MEDER CRR Series Reed Relay is a low-profile device made with a ceramic case that exactly matches the thermal coefficient of expansion of the reed switch glass and the reed lead to eliminate any potential packaging stress. This reed relay is the smallest in the industry and switches into the billions of operations.Capable of withstanding reflow-soldering operations up to 260°C, the relay uses no internal solder and has 1 • Ceramic / thermoset molded package • Patent pending • Smallest in the industry • No lead frame surface mount design eliminates skewing of leads and coplanarity issues
14 Ohms. • No internal solder connections • Available with BGA • Internal magnetic shield standard

APPLICATIONSFEATURES

• Very low profile • Gold plated leads • Low thermal offset typical 1 μ V • Test and measurement • TCE matching of all internal components • Medical equipment • Insulation resistance typical 10
14 ohms • Telecommunications • 3 Volt option available

DIMENSIONS (Non-BGA)

*All dimensions in mm (inches)

PIN OUT PCB LAYOUT PAD LAYOUT

(Top View) (Bottom View)
1.200.70 Ø 0.95 [0.0472] Ø 0.0031] 0.50 [0.0197][0.1417][0.0276][ 10x R0.475 [0.187] 1.45[0.0571] [0.1732][0.0866] 2.204.40 1.20 [0.0472] 1.475 [0.0581] 3.125 3.60 0.95 [0.0374][0.378][0.123] 0.925[0.0364] 9.60

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