Master Bond -- Two Component Series Application Selector Guide - Master Bond - #1 |
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MASTER BOND TWO COMPONENT SERIES APPLICATION SELECTOR GUIDESelected Two Component Epoxy Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds Partial Listing Only –— Other Grades AvailableMix Ratio Mixed Viscosity Set-Up Time Cure Schedule Service Temp Master Bond Grade by weight Color Code RT, cps Minutes, RT Temp/Time, °F Range, °F Applications EP21 100/100 “A” gray “B” tan 50,000-60,000 60-90 24-48 hrs @ RT 2 hrs @ 200°F -60 to +250°F High performance general purpose adhesive, sealant and coating. Can alter mix ratio to vary toughness and flexibility. EP21AO 100/100 “A” gray “B” white light paste 45-60 24-48 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Thermally conductive version of EP21. Used primarily for bonding and sealing. EP21AOLV 100/100 “A” gray “B” white 40,000-50,000 75-90 24-48 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Lower viscosity version of EP21AO. Easy to use, thermally conductive potting material/encapsulant. EP21AN 100/100 “A” gray “B” white light paste 60-90 24-48 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Higher thermally conductive version of EP21AO, Thermal conductivity at 75°F >22 BTU•in/ft² •hr•°F. EP21AR 100/50 “A” clear “B” amber 10,000-15,000 30-35 24-48 hrs @ RT 2-2½ hrs @ 200°F -60 to +275°F Superb resistance to inorganic and many organic acids. For bonding, sealing and coating. EP21BAS 100/100 “A” off white “B” off white >175,000 60-90 48-60 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Radio opaque adhesive/sealant/coating for medical and medical electronic applications. EP21FL 100/25 “A” amber “B” amber 3,000-4,000 120-180 24-48 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Flexible version of EP21. Superior thermal cyclability, shock and impact resistance. Excellent adhesive/sealant. EP21FRLVSP 100/100 “A” red “B” white 25,000-30,000 30-60 24-48 hrs @ RT 2 hrs @ 200F -60 to +250°F Flame retardant. UL94 V-0 certified system. For potting and bonding. EP21HT 100/100 “A” clear “B” amber 50,000-60,000 50-70 24-48 hrs @ RT 2 hrs @ 200°F -60 to +400°F High temperature resistant version of EP21 with excellent chemical resistant properties. Convenient handling. EP21LSCL 100/60 “A” clear “B” clear 1,000-1,500 30-35 24 hrs @ RT 1-2 hr @ 200°F -65 to +250°F Transparent, non-yellowing version of EP21 for bonding, sealing and coating. For optical and display applications. EP21LV 100/100 “A” clear “B” amber 6,000-8,000 60-90 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F Lower viscosity than EP21. Food grade & USP Class VI certified. For bonding, sealing, coating & encapsulation. EP21ND 100/100 “A” gray “B” tan paste 45-60 24-48 hrs @ RT 2 hrs @ 200°F -60 to +250°F Non drip version of EP21. Suitable for vertical applications. Excellent adhesive/sealant. EP21ROK 100/100 “A” gray “B” light tan moderate paste 90-120 24-48 hrs @ RT -60 to +250°F Durable, tough, “no-skid” flooring with high chemical resistance. EP21TCHT-1 100/66 “A” off white “B” off white light paste 30-35 18-24 hrs @ RT 1-2 hrs @ 200°F 4°K to +400°F NASA approved low outgassing; thermally conductive, for bonding and sealing. Cryogenically serviceable. EP21TDC 100/100 “A” clear “B” amber 40,000-50,000 60-75 24-48 hrs @ RT 2 hrs @ 200°F -100 to +250°F Excellent general purpose adhesive/sealant. Convenient handling. Good impact & shock resistance. EP21TDC-2 33/100 “A” clear “B” amber 70,000-80,000 75-90 72 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Highly flexible with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. EP21TDC-2AO 33/100 “A” white “B” off white paste 90-120 48-72 hrs @ RT 3 hrs @ 200°F -100 to +250°F Thermally conductive version of EP21TDC-2. Particularly well suited for bonding dissimilar substrates. EP21TDC-7 100/700 “A” clear “B” amber 120,000-140,000 120-150 48-96 hrs @ RT 3-4 hrs @ 200°F -100 to +250°F Ultra high flexibility. Exceptional for bonding most rubber materials (natural, SBR, nitrile, etc.). EP21TDCHT 100/100 “A” clear “B” amber 100,000-120,000 60-90 48 hrs @ RT 2-3 hrs @ 200°F -100 to +350°F High temperature resistant general purpose system. Excellent adhesion to a wide variety of substrates. EP21TDCS 100/100 “A” silver “B” silver smooth paste 30-40 24-36 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F High performance, silver filled, toughened system with excellent bond strength and cryogenic applicability. |
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