MASTER BOND MICROELECTRONIC APPLICATION SELECTOR GUIDE
Selected Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds Specially Formulated for Microelectronic Applications Partial Listing Only –— Other Grades Available I. ADHESIVES/SEALANTS Electrically Insulating —
Mix Ratio Viscosity Set-Up Time Cure Schedule Service Temp Master Bond Grade Type of System by weight RT, cps Minutes, RT Temp/Time, °F Range, °F Applications EP21 2 part epoxy 100/100 50,000-60,000 60-90 24-48 hrs @ RT 2 hrs @ 200°F -60 to +250°F High performance general purpose adhesive/sealant. Can alter mix ratio to vary toughness and flexibility. EP21ND 2 part epoxy 100/100 paste 45-60 24-48 hrs @ RT 2 hrs @ 200°F -60 to +250°F Non-drip version of EP21. Excellent physical & electrical properties. Convenient handling. EP21TDCHT 2 part epoxy 100/100 100,000-120,000 60-90 48 hrs @ RT 2-3 hrs @ 200°F -100 to +350°F High temperature resistant general purpose system. Excellent adhesion to a wide variety of substrates. EP21TDC-2 2 part epoxy 33/100 70,000-80,000 75-90 72 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Highly flexible with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. EP30-1 2 part epoxy 100/25 1,500-1,600 25-30 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F Low viscosity. Transparent. Exceptionally low shrinkage. Superior physical strength & chemical resistance properties. EP30LTE 2 part epoxy 100/10 15,000-20,000 30-40 24-48 hrs @ RT 2-3 hrs @ 200°F -60 to +250°F Remarkably low coefficient of expansion. Exceptionally low shrinkage. Very high dimensional stability. EP33 2 part epoxy 100/70 50,000-60,000 50-60 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +450°F High temperature resistance. Good physical strength properties & dielectrics. Can resist high radiation levels. EP42LV 2 part epoxy 100/40 2,000-2,300 25-35 24-36 hrs @ RT 2-3 hrs @ 200°F -60 to +300°F Low viscosity, highly chemically resistant system. Good bond strength to a wide variety of substrates. EP65HT-1 2 part epoxy 100/10 60,000-70,000 3-5 min 20-30 min @ RT -60 to +400°F Ultra-fast curing, high strength system. Superb heat resistance. NASA low outgassing approved. EP45HT 2 part epoxy 100/30 40,000-50,000 12-24 hrs 1 hr @ 150°F plus 2-3 hrs @ 300°F -80 to +500°F High temperature & chemically resistant structural adhesive &
sealant. MMM-A-132 type III. Requires heat cure . Supreme 3HT 1 part epoxy 1 part 120,000-135,000 30-60 sec @ 300°F 20-30 min @ 250°F 5-10 min @ 300°F -100 to +350°F Toughened system. Superior thermal cycling properties as well as excellent mechanical & thermal shock resistance. Supreme 10HT 1 part epoxy 1 part >250,000 3-5 min @ 300°F 60 min @ 250°F 45 min @ 300°F 4°K to +400°F Ultra-high strength (shear & peel), NASA low outgassing approved. Outstanding toughness & durability. Supreme 10HTND-2 1 part epoxy 1 part paste 3-5 min @ 300°F 60 min @ 250°F 45 min @ 300°F -100 to +400°F Non-drip version of Supreme 10HT with similar physical & mechanical properties. Will not flow when heat cured. MB297FL cyanoacrylate 1 part 1,500- 1,800 45-60 sec 5 min @ RT humidity dependant -40 to +250°F Moderate viscosity, toughened system with superior impact and shock resistance. MB302 cyanoacrylate 1 part 75-100 15-20 sec 2-3 min @ RT humidity dependant -40 to +250°F Low viscosity with excellent adhesion to metals, plastics, rubbers and ceramics. MasterSil 702 1 part silicone 1 part paste 30-45 sec 24-48 hrs @ RT depends on depth of cure & humidity -75 to +400°F Non-corrosive type system. Excellent bond strength. Superior electrical insulation properties. MasterSil 711 1 part silicone 1 part 60,000 3-5 min 4-6 hrs @ RT depends on depth of cure & humidity -75 to +400°F Exceptionally fast curing, non-corrosive system. Flowable. For manufacturing and repair applications. UV10 UV curable 1 part 300-400 not applicable 5-30 sec depends on depth of cure & light intensity -60 to +250°F Low viscosity general purpose system. Cures rigid. Excellent resistance to water and other chemicals. UV15-7DC UV curable 1 part 2,500-5,000 10-45 sec plus 15-30 min @ 250°F depends on depth of cure & light intensity -60 to +300°F Dual cure UV. Will cure in shadowed out areas by adding heat (250°F). Excellent physical & electrical properties.
