MASTER BOND LOW OUTGASSING APPLICATION SELECTOR GUIDE
For Aerospace, Microelectronic, Optical and Industrial Applications
Master Bond Inc. has developed various “low outgassing” epoxy resin based adhesive systems to meet the maximum 1% TML and maximum 0.1% CVCM acceptability criteria as outlined in ASTM E595. These adhesives comprise both two and one component compositions requiring either ambient or elevated temperature cures as specified below. These “low outgassing” epoxy adhesive compounds are manufactured with exceptionally high quality standards in order to assure reproducible high performance even under the most demanding service conditions. It should be noted that all systems should be fully cured prior to any low outgassing-application.
Two Component Epoxies —
Mix Ratio Mixed Viscosity Set-Up Time Cure Schedule Service Temp Master Bond Grade by weight Color Code RT, cps Minutes, RT Temp/Time, °F Range, °F Applications EP21LV 100/100 “A” clear “B” amber 6,000-8,000 60-90 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F Low viscosity, general purpose system. Excellent physical strength and electrical insulation properties. For bonding, sealing, coating & encapsulation. *EP21TCHT-1 100/66 “A” off white “B” off white light paste 30-35 18-24 hrs @ RT 1-2 hrs @ 200°F 4°K to +400°F NASA approved low outgassing. Thermally conductive, room temperature curing system for bonding and sealing. Bonds well to a wide variety of substrates. EP21TDC-2 33/100 “A” clear “B” amber 70,000-80,000 75-90 72 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Highly flexible with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. Superior electrical insulation properties. EP21TDCS 100/100 “A” silver “B” silver smooth paste 30-40 24-36 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F High performance, silver filled, toughened system with very low resistance. Excellent
adhesive properties. Cryogenically serviceable. Convenient handling. *EP29LPSP 100/65 “A” clear “B” translucent 700 > 6 hrs 5-7 days @ RT 8-12 hrs @ 150°F 4°K to +250°F NASA approved low outgassing. Can withstand cryogenic temperatures as well as cryogenic shock. Excellent optical clarity. Very low viscosity. *EP30-2 100/10 “A” clear “B” clear 1,800-2,000 20-25 24 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F NASA approved low outgassing transparent system, excellent for optical and fiber optic bonding & sealing. Superb chemical resistance along with excellent physical strength properties. *EP30AN-1 100/10 “A” gray “B” clear 20,000-30,000 30-40 24-36 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F NASA approved low outgassing with exceptionally high thermal conductivity. Low viscosity. Ideal for potting and encapsulation. Also an excellent
adhesive. EP30FL 100/25 “A” amber “B” clear 2,000-3,000 25-30 24 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F For high performance sealing, potting, encapsulating and bonding. Excellent flexibility. Cryogenically serviceable. Marvelous electrical insulation properties. *EP30LTE-LO 10/1 “A” off white “B” tinted yellow 25,000-30,000 45-60 48 hrs @ RT 2-4 hrs @ 200°F -60 to +250°F NASA approved low outgassing, low coefficient of thermal expansion, superb dimensional stability, for bonding, sealing, coating, and small castings. *EP37-3FLFAO 100/100 “A” off white “B” light yellow 18,000-22,000 75-90 48-60 hrs @ RT 3-5 hrs @ 200°F -4°K to +250°F NASA approved low outgassing, good thermal conductivity used for cryogenic sevicability, highly flexible, used for potting, bonding , sealing and casting. EP45HT 100/30 “A” clear “B” brown 40,000-50,000 12-24 hrs 1 hr @ 150°F plus 2-3 hrs @ 300°F -80 to +500°F High temperature and chemically resistant structural
adhesive and sealant. Meets MMM-A-132 type III. Requires heat cure .
