MASTER BOND HIGH TEMPERATURE RESISTANT APPLICATION SELECTOR GUIDE
Selected Adhesives, Sealants, Coatings, Encapsulants & Potting Compounds Specially Formulated for High Temperature Applications Partial Listing Only –— Other Grades Available Two Component Epoxies —
Mix Ratio Mixed Viscosity Set-Up Time Cure Schedule Service Temp Master Bond Grade by weight Color Code RT, cps Minutes, RT Temp/Time, °F Range, °F Applications EP21HT 100/100 “A” clear “B” amber 50,000-60,000 50-70 24-48 hrs @ RT 2 hrs @ 200°F -60 to +400°F General purpose type
sealant,
adhesive & encapsulant. Convenient handling & easy processing. Meets food grade specifications. Superior electrical insulator. Also available in a non-drip version called EP21HTND. EP21AOHT 100/100 “A” gray “B” off white paste 60-80 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +400°F Thermally conductive/electrically insulative. For bonding & sealing. Superior bond strength & dimensional stability. Adheres well to metals, plastics, glass & ceramics. EP21ANHT 100/100 “A” light gray “B” light gray paste 60-80 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +400°F High thermally conductive version of EP21AOHT. Thermal conductivity > 22 BTU•in/ft
2 •hr•°F. EP21TCHT-1 100/60 “A” off white “B” off white light paste 30-35 18-24 hrs @ RT 1-2 hrs @ 200°F 4°K to +400°F Thermally conductive/electrically insulative. NASA approved for low outgassing. For bonding, sealing and encapsulating. Low coefficient of expansion. EP21TDCHT 100/100 “A” clear “B” amber 100,000-120,000 60-90 48 hrs @ RT 2-3 hrs @ 200°F -100 to +350°F Toughened system. Combines convenient handling with superior mechanical & thermal shock resistance. Also has excellent thermal cycling properties. Well suited for bonding & sealing dissimilar substrates. EP30HT 100/25 “A” clear “B” clear 35,000-45,000 25-35 24 hrs @ RT 1-2 hrs @ 200°F -60 to +400°F Transparent system. Widely used in optical and electro-optic applications. For bonding, sealing, coating and potting. Superb physical strength, chemical resistance and electrical insulation properties. EP30AOHT 100/10 “A” off white “B” clear 70,000-80,000 30-35 24-36 hrs @ RT 1-2 hrs @ 200°F -60 to +400°F Thermally conductive, electrically insulative version of EP30HT. Good flowability. Widely used for potting and encapsulation. Superior dimensional stability. EP30ANHT 100/10 “A” light gray “B” clear 70,000-80,000 30-35 24-36 hrs @ RT 1-2 hrs @ 200°F -60 to +400°F High thermally conductive version of EP30AOHT. Thermal conductivity >22 BTU•in/ft
2 •hr•°F. Possesses low coefficient of expansion. EP30-3 100/33 “A” clear “B” clear 5,000-6,000 12-18 hrs 30-45 min @ 160°F plus 2-3 hrs @ 300°F -60 to +435°F Transparent, low viscosity system for bonding, sealing and encapsulation. High light transmission properties. Superb chemical resistance. Widely used in optical and electro-optic applications. Requires heat cure . EP33 100/70 “A” gray “B” amber 50,000-60,000 50-60 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +450°F Superb
adhesive/sealant. Can resist high radiation levels. Good physical strength properties and superior dimensional stability. Readily machinable. EP34 100/70 “A” black “B” amber 70,000-80,000 50-60 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +450°F Mineral filled version of EP33. Superior electrical insulation properties. Exceptionally high tensile strength. Requires heat cure . EP34CA 100/50 “A” black “B” brown 5,000-6,000 12-24 hrs 1 hr @ 150°F plus 2-3 hrs @ 300°F -60 to +500°F Low viscosity structural
adhesive. Also used for encapsulation, filament winding and sealing. Widely used in high temperature electronic and geophysical applications.
