MASTER BOND APPLICATION SELECTOR GUIDE FOR ELECTRO-OPTIC, FIBER-OPTIC & LASER APPLICATIONS
Selected Adhesives, Sealants, Coatings & Castings Partial Listing Only –— Other Grades Available
The Master Bond product line includes both one and two component epoxy resin compounds and one component UV curable compositions. The epoxy resin compounds are all specially formulated to maximize resistance to liquid water, water vapor and other adverse environments. The ultraviolet compositions cure tack free in the presence of air. All Master Bond products have been carefullyprocessed to exclude such potentially objectionable contaminants as chlorine and other halogens as well as sodium and related elements. They provide innovative solutions to the many processing problems of these industries and virtually eliminate quality control difficulties caused by corrosion and other environmentally induced conditions. Typical applications range from bonding and potting fiber-optic cables, connectors and terminations, and upgrading the vibration and shock resistance of electro-optic assemblies. Other applications include cementing and coating optical parts, potting LED devices, optical replications, bonding ferrules and connectors, and coating or encapsulating a wide variety of electro-optic and laser components.
Two Component Epoxies —
Mix Ratio Mixed Spectral Index of Master by Viscosity Transmittance % Refraction, Set-Up Time Cure Schedule Service Temp Bond Grade Color weight RT, cps (3100-9000 Å) nD Minutes, RT Temp/Time, °F Range, °F Applications EP21LSCL “A” clear “B” clear 100/60 1,000-1,500 >97 1.56 30-35 24 hrs @ RT 1 hr @ 250°F -65 to +250°F Transparent, low viscosity, non-yellowing version of EP21LV. Used for bonding, sealing, coating and potting. EP21LV “A” clear “B” amber 100/100 6,000-8,000 >90 1.55 60-90 24-48 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F Easy to use with excellent physical and electrical properties. For bonding, sealing, coating and encapsulation. EP21TDC-2 “A” clear “B” amber 33/100 70,000-80,000 not applicable not applicable 75-90 72 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Highly flexible system with exceptional thermal and mechanical shock resistance. Suitable for cryogenic applications. EP21TDCS “A” silver “B” silver 100/100 smooth paste not applicable not applicable 30-40 24-36 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F High performance, silver filled, toughened system with excellent bond strength. Cryogenically serviceable. EP21TP-2 “A” clear “B” amber 100/100 1,500-2,000 90 1.58 30-45 48-60 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F For potting and encapsulation. Transmits light over a wide wavelength range including IR. EP29LPSP “A” clear “B” clear 100/65 700 >97 1.55 > 6 hrs 5-7 days @ RT 8-12 hrs @ 150°F 4°K to +250°F Transparent system. NASA low outgassing approved. Outstanding low temperature serviceability. Withstands cryogenic shocks. EP30 “A” clear “B” clear 100/25 400- 500 >97 1.56 25-30 18-24 hrs @ RT 1-2 hrs @ 200°F -60 to +250°F Widely used for bonding fibers to connectors and/or fibers into ferrules. Easily polished. Also for optical replications. Low shrinkage. EP30-1 “A” clear “B” clear 100/25 1,500-1,600 >97 1.55 20-35 24-48 hrs @ RT 2 hrs @ 200°F -60 to +250°F Lower viscosity, slightly toughened system for bonding fibers to connectors and for casting optically clear components. Easily polished. EP30-3 “A” clear “B” clear 100/33 5,000-6,000 >97 1.57 12-18 hrs 30-45 min @ 160°F plus 2-3 hrs @ 300°F -60 to +435°F Transparent, high temperature and chemically resistant version of EP30. For optical potting and bonding. Requires heat cure .
