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MASTER BOND CRYOGENIC APPLICATION SELECTOR GUIDE

For Aerospace, Scientific and Industrial Applications Partial Listing Only –— Other Grades Available

Master Bond Inc. offers a wide range of versatile, high performance epoxy formulations designed to withstand the severe conditions found in cryogenic environments. They are available as one or two part systems, requiring either ambient or elevated temperature cures as specified below. When fully cured, these adhesive/sealants offer excellent physical strength properties, long term durability, superb chemical resistance, as well as high bonding strengths to both metallic and non-metallic substrates. Included in this versatile group are electrically conductive systems, thermally conductive/electrically insulating systems, NASA low outgassing approved systems, as well as a formulation that is capable of withstanding severe cryogenic shocks. Master Bond’s technical support staff will be glad to recommend the system best suited to meet your application needs.

Two Component Epoxies —

Mix Ratio Mixed Viscosity Set-Up Time Cure Schedule Service Temp Master Bond Grade by weight Color Code RT, cps Minutes, RT Temp/Time, °F Range, °F Applications EP21TCHT-1 100/66 “A” off white “B” off white light paste 30-35 18-24 hrs @ RT 1-2 hrs @ 200°F 4°K to +400°F High temperature resistant. NASA low outgassing approved. Superb thermal conductivity with good electrical insulation properties. For bonding & sealing. EP21TDC-2 33/100 “A” clear “B” amber 70,000-80,000 75-90 72 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Adhesive/sealant with high flexibility and exceptional thermal and mechanical shock resistance. Bonds well to a wide variety of substrates. EP21TDCS 100/100 “A” silver “B” silver smooth paste 30-40 24-36 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F High performance, silver filled, toughened system with excellent bond strength and physical strength properties. Convenient handling. EP21TDCSFL 100/100 “A” silver “B” silver paste 45-60 24-48 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F High flexibility version of EP21TDCS. Exceptionally high elongation. Excellent peel strength. Repairable. EP29LPSP 100/65 “A” clear “B” translucent 700 > 6 hrs 5-7 days @ RT 8-12 hrs @ 150°F 4°K to +250°F Capable of withstanding severe cryogenic shocks. Very low viscosity. NASA low outgassing approved. Transparent. For bonding, sealing and potting. EP30DP 100/10 “A” light amber “B” clear 3,000-4,000 60-90 48 hrs @ RT 2-3 hrs @ 200°F 4°K to +250°F Toughened sealant, potting and encapsulating system. Allows for repairability. Good thermal cycling properties. EP30FL 100/25 “A” amber “B” clear 2,000-3,000 25-30 24 hrs @ RT 1-2 hrs @ 200°F 4°K to +250°F Low viscosity. Flexible. For high performance potting, encapsulating and sealing. Excellent thermal and mechanical shock resistance. EP37-3FLF 100/100 “A” clear “B” clear 1,500-1,800 120-150 48-72 hrs @ RT 3 hrs @ 200°F 4°K to +250°F High flexibility and elongation. Superb optical transmission properties. Can withstand rigorous thermal cycling. For bonding, sealing and potting. EP37-3FLFAO 100/100 “A” white “B” white 18,000-22,000 3 hrs 4-5 days @ RT 4-6 hrs @ 200°F 4°K to +250°F Thermally conductive, electrically insulation version of EP37-3FLF. For potting & encapsulation. Repairable. EP50-1.5 100/100 “A” clear “B” clear yellow 8,000-10,000 90-120 sec 2-3 hrs @ RT 4°K to +250°F Very fast setting adhesive/sealant. Good physical strength properties. EP51 100/100 “A” clear “B” tan 10,000-12,000 5 min 4-6 hrs @ RT 4°K to +250°F Fast curing, general purpose “5 minute” epoxy. Excellent long term durability.