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Laser micro machining, Picosecond laser, Laser
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HYPER RAPID HYPER RAPIDIndustrial, High Power Picosecond LaserApplications: The RAPID series of pi co se cond lasers is designed for industrial microprocessing; it offers a new level of precision and versatility.The RAPID series ps-lasers can ablate any material with minimum thermal side effects and with high precision. The lateral resolution is in the µm-range; depth control is about 10nm. The photo shows micromachined pockets in glas. The HYPER RAPID is specially designed for industrial micromachining applications that require high throughput and cost effi ciency, like in the semicon and photovoltaic industry. Other applications include large area surface treatment, material research, nonlinear optics like UV generation and OPG pumping, and ranging.200 µm deep pocket in glas Features: • 25 W average power at 1000 kHz – please ask for details of the 50W model • 200-1000 kHz repetition rate, programmable pulse sequences • ps-pulses with up to 125 µJ energy,10 MW-range peak power, and high contrast versus background Excellent beam quality: no astigmatism, no ellipticity; Typical measurement at 1064nm, 200kHz; • high power and pointing stability • high quality beam at all repetition rates, M˛<1.5 @1064nm, M˛<1.2 @532nm • compact mono-block laser head, sealed, temperature controlled • laser head isolated against optical feedback • internal closed loop chiller • intuitive software on industrial PC, interface and optional dll-software for external control • single phase mains electrical connection • easy integration into work station • low maintenance and low cost of ownership Intensity profile at 500kHz, 15W @532nm; typical measurement data sheet HYPER RAPID 070108 |
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