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LPKF-LDS Process

LPKF-LDS Process
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Laser Direct Structuring Technology (LPKF-LDS) for Moulded Interconnect Devices Laser & Electronics

Innovative product design through MID technology For a state-of-the-art dental hand-piece the basic attachment board has been designed using LPKF-LDS technology. This enables compact, easy construction and a higher level of functionality. The device integrates control of heated water supply, air supply and special illumination. The 3-dimensional circuitry performed directly onto the plastic component eliminates cables and reduces complexity. Benefiting from the LPKF-LDS process it has been possible to reduce weight and diameter size of the hand-piece. This improves the ergonomics: Treatment...

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A higher degree of integration expands your possibilities Since 1997, LPKF has developed MID technology as a laser-based procedure for the production of MID’s called: The LPKF-LDS Process. With LPKF’s Laser Direct Structuring process (LDS) it is possible to produce circuit layouts on complex three-dimensional carrier structures. The laser beam structures the layout directly into the molded plastic part. As a result, weight and fitting space can be effectively reduced. Your design teams enjoy complete 3D capability on freeform surfaces and great freedom for redesigns. Thus LPKF-LDS opens up...

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Flexible solution for manufacturing 3-dimensional circuitry One of the main advantages of processing materials with laser light is the combination of defined energy input on the material with high processing speeds. The circuit layout is not predetermined by the geometry of a fixed tool. This provides shorter lead times and high levels of flexibility. A better product at a lower cost 2-shot injection moulding and hot stamping are already used to manufacture MIDs (Moulded Interconnect Device). Both of these methods are tied to product-specific tools to create a circuit on the component....

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The process steps of LPKF-LDS 1. Injection moulding The parts to be laser structured are produced using 1-shot injection moulding of commercially available doped thermoplastic. Compared to 2-shot moulding only a simple tool is needed and the moulding process is faster. Read more about the large portfolio of LPKF-LDS-graded materials on page 10. 2. Laser activation The laser-activatable thermoplastic is doped with a special additive. It is activated by the laser beam. A physical-chemical reaction forms metallic nuclei. These act as a catalyst for reductive copper plating. In addition to...

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More functions, less cables in car steering wheels with LPKF-LDS technology; TRW Automotive. Integrating tomorrow’s technology in today’s production The increasing amount of electronic features is a challenge for many branches and markets. The industry demands technologies to reduce dimensions and weight of components. At the same time it is necessary to simplify prototyping operations and shorten the time to market. The LPKF-LDS technology meets exactly these needs. LPKF-LDS for auto-motivated people Today’s cars live on the numerous sensors and eectronic assistants, which improve the...

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Telecommunication: get connected Diversification, styling, miniaturization and cost reduction are trends in the field of portable electronics. End-users are expecting increasing amount of novel functions available inside trend-looking compact covers. The LPKFLDS technology offers great potential for miniaturization and a very high flexibility when changing and improving functionality – especially when it comes to modifying the features into several products. This has been demonstrated millionfold with LPKF-LDS based internal antennas of mobile phones, portable computers etc. LPKF-LDS based...

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Substitution of cable harness If a cable harness gets more and more complex, LPKF-LDS assists the engineer to simplify the product in order to improve quality and reliability. The replacement of the cable harness makes the manufacturing more efficient, mounting becomes easier and faster. When the available space is premium designers enjoy the possibility to overcome issues, which accompany flex circuit boards as e.g. complex flat projection and bending radii. Variations of the artwork can be realized by simply changing the laser program. Thus LPKF-LDS technology opens the door to start new...

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Through-hole capability The LPKF-LDS technology can provide plated through-holes to connect surfaces of MIDs. This amplifies the layout possibilities. This way the 3D circuit board serves as an attachement body for microphones in a state-of-the art hearing aid (see picture above). Compliant with SMT requirements Products created with LPKFLDS show full SMT capability. For automatic assembly lines components can be placed on flat surfaces located at stepped heights. Fine and finest resolution LPKF-LDS provides fine pitches. Track widths of 150 µm and gaps of 200 µm have proven to be a...

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Take advantage To take full advantage of the LPKF-LDS technology, tried-and-tested solutions, comprehensive practical experience and support are available for all process steps. This assures the economical Engineering polymers Cost driven High performance polymers Performance driven and uncomplicated operation of the innovative production method. Large material portfolio The application-oriented selection of the laser-activatable plastics is important. A variety of manufacturers guaran tee the availability of material for almost any tough requirement. Suppliers of electronic components use...

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Design-rules at a glance Process-optimized design of the circuit carriers is essential to ensure high quality MID production and to benefit best from LPKF-LDS technology. Walls and ejection pins One of the important goals during the development and manufacture of 3-dimensional circuitry is the efficient use of space with the finest possible structures. Track widths of ≥150 µm and gaps of ≥200 µm have proven ideal in practice, although thinner tracks and gaps are possible. Zones to be subsequently activated should not touch walls directly. The separation for walls with an angle of 45° should...

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