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LPKF Laser Direct Structuring for 3D Molded Interconnect Devices

LPKF Laser Direct Structuring for 3D Molded Interconnect Devices
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LPKF Laser Direct Structuring for 3D Molded Interconnect Devices - 1

Three-Dimensional Circuits LPKF LDS: Laser Direct Structuring for 3D Molded Interconnect Devices Laser & Electronics

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Innovative Product Design with MID Technology State-of-the-art technology: a circuit carrier was designed according to the LPKF LDS process for a complex dental tool. This makes a compact design and more functionality possible. The control for the warm water and air supply and a special lighting device are integrated in the hand piece. The three-dimensional circuit comes about without cables or separate circuit boards directly on the plastic carrier. The LPKF LDS process reduces the weight and diameter of the tool. That improves the ergonomics: Handling is pleasant and the manual stress on...

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LPKF Laser Direct Structuring for 3D Molded Interconnect Devices - 3

More Functionality – New Possibilities Since 1997, LPKF has been working on three-dimensional circuit boards and has developed a laser-supported process for producing three-dimensional MIDs (molded interconnect devices): the LPKF LDS process. Circuit layouts can be created on complex three-dimensional carrier structures using LPKF laser direct structuring. The laser beam inscribes the layout directly on the plastic component. The weight and dimensions of the component can thus be noticeably reduced. Developers profit from complete 3-D capability on free-form surfaces and additional freedom...

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Laser-structured and metallized finger tips for a robot hand (Source: Citec, Bielefeld University) Flexible Solution for Three-Dimensional Circuits One of the substantial advantages in processing materials with the laser is the combination of a clearly defined energy input on the material and a high processing speed. The layout of the circuit is not predetermined by the geometry of a special tool. This makes a shorter development time and a higher degree of flexibility possible. A Better Product at a Lower Cost Two-component injection molding and hot stamping are recognized methods in...

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LPKF Laser Direct Structuring for 3D Molded Interconnect Devices - 5

The LPKF LDS Process 1. Injection Molding The parts are produced in single-component injection molding from commercially available thermoplast provided with additives. In comparison to two-component injection molding, only one simple tool is required and the molding process is quicker. You can find further information about the large LPKF portfolio of LDS-suitable materials on page 14. 2. Laser activation Activation of the thermoplastic material is done by laser beam. A physical-chemical reaction creates metallic seeds – that is the activation process. In addition to activation, the laser...

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Tomorrow’s Technology in Today’s Production The increasing use of electronics is a challenge for many industries and markets. Industry requires technologies that reduce the dimensions and weight of components. At the same time, production of prototypes has to be simplified and the time until market launch has to be shortened. The LPKF LDS process meets these requirements exactly. LPKF LDS in Automotive Engineering Modern vehicles require a multitude of sensors and electronic assistants which increase the comfort and safety of the vehicle passengers. At the same time, the number of...

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Telecommunication – Staying in Contact A multitude of types, design, miniaturization and cost reduction characterize the development of portable electronic devices. End users expect more and more functions in up-to-date compact enclosures. The LPKF LDS technology has a large potential for miniaturization of components. At the same time, it offers a high level of flexibility when it’s a matter of change and improvement of functionality – especially if features are supposed to be variably adapted for several products. Antennas in mobile phones and laptops produced with LPKF LDS technology...

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Inspiration for New Layouts General electronics, medical technology, automobiles, telecommunication, consumer products – LDS components are found in many devices and systems in many different areas of application and solve a whole range of demanding problems. What is more convincing than projects that others have already successfully implemented? In the following, some applications represent the respective technical challenge. They illustrate how theoretical approaches have become real components – and show the potential for LDS technology to develop in completely different markets....

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Through-Hole Plating Reliable through-hole plating can be produced with LPKF LDS technology in order to connect the surfaces of MIDs. This expands the possibilities for the layout. So applied, a 3D molded interconnect device serves to fix microphones in hearing aids according to the latest technology. Component for hearing aid (Manufacturer: Siemens Audiologische Technik GmbH [Siemens Hearing Instruments], Harting AG), images right: HSG-IMAT Compatible with SMT Products produced with LPKF LDS are completely SMT-capable. Components on even surfaces of the same level can be mounted by...

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Reliable Contact LDS components instead of wiring harnesses – with LDS components additional cabling can be omitted. Along with the costs of cabling, the assembly outlay is also reduced. If electronic components are soldered directly onto LDS components or attached by means of a conductive adhesive, additional circuit boards can often also be omitted. Steering wheel controls (Source: TRW Automotive for BMW) Galvanic Reinforcement New developments for new markets: with galvanic reinforcement, components come about that also withstand high mechanical and thermal stresses or are well suited to...

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LED Clip System Contact, attachment and heat conduction in one component. The functional components are arranged on a disk-shaped base medium. Two magnets hold the components, a metal layer on the bottom is for heat dissipation and LDS tracks supply the highpower LED with electric energy. Clip N’Slide LED light (Source: HomeLights/Molex) LED Retrofit Tracks on metallic bodies? Covering with LDS PowderCoating creates a structurable surface. The layout options of LDS technology can thus be combined with the characteristics of metallic materials – an outstanding combination for demanding LED...

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