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Depaneling of Assembled PCBs
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Catalog excerpts

Depaneling of Assembled PCBs - 1

Stress-Free Depaneling of Assembled Boards LPKF MicroLine 6000 S

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Depaneling of Assembled PCBs - 2

Laser Depaneling – Closer to the Edge The LPKF MicroLine 6000 S helps to significantly improve the process control in PCB depaneling operations: The laser process keeps delicate components, soldered connections and sensitive substrates free from any mechanical stress. At the same time the LPKF MicroLine 6000 S produces more value per panel by cutting with minimal spaces between the boards – components can be placed right next to the edge of the board to minimize size and weight.

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Depaneling of Assembled PCBs - 3

Stress-Free Cutting of Populated Boards The LPKF MicroLine 6000 S is ideal for clean and particulate-free separation of single boards from a larger panel of flexible, thin rigid and rigid-flexible materials. The need for accurate board outlines turns from a challenge into an advantage. The system features a clearance between the laser head and the working area surface of 30 mm, on a large area of 610 x 457 mm (24 x 18”). This allows for processing populated PCBs with surface mount devices (SMD) on both sides. The novel production-ready design provides simple integration into the production...

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Depaneling of Assembled PCBs - 5

• Maximum throughput • Easy operation • High component clearance Production-Ready Right Away Process-Integrated Quality Assurance The MicroLine 6000 S features integrated feeders and SMEMA-compatible interfaces. The gantry architecture allows for transportation of the applications through the machine via conveyor handling or by operating a load/unload unit. A new drift compensated scanning head and an automatic power adjustment function ensure high process stability for the LPKF MicroLine 6000 S. Due to these robust features the system is capable of cutting at controlled depths – a special...

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Depaneling of Assembled PCBs - 6

Depaneling of Assembled Boards The LPKF MicroLine 6000 S is perfect for cutting break-out tabs and complex contours in rigid, rigid-flex and flexible PCB substrates – thin and flexible materials in particular. The system provides clean cuts in PI, FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials. Sensitive, Accurate Process Arbitrary Shapes, Narrow Cuts The non-contact process prevents mechanical deformation – the laser beam singulates boards keeping delicate circuits safe. Micro cracks or delamination effects are no longer an issue; as well...

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Depaneling of Assembled PCBs - 7

• Stress-free cutting – higher yield • Superior accuracy – more boards per panel • Fast set-up – increased productivity

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Depaneling of Assembled PCBs - 8

The UV laser system is ideal for micromachining metals, plastics, ceramic materials etc., and material combinations. Application examples are: drilling of microvias in HDI circuit boards, structuring of TCO/ITO, laser removal of tin-resist, drilling of flex material, opening of solder-resist, as well as laser repair and rework of bare and assembled PCBs. Please contact LPKF for application reports and further information. Technical Data: LPKF MicroLine 6000 S More Applications for the LPKF MicroLine 6000 S Data input formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++ Laser...

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