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Text version of the page
| Applications Ultrafine boards Product reliability is an utmost priority in highly integrated circuits. The LPKF ProtoLaser Star exceeds the specifications for track/gap widths of less than 125 Mm/125 pm defined for ultrafine technical applications, and is therefore an ideal solution for the efficient prototyping of complex digital circuits. | ||||||||||||||||||||
| Circuits on flexible substrates The LPKF ProtoLaser S also works just as well on flexible substrates, producing precise, reliable results without causing any damage to the substrate. The flexible materials are held firmly in place on the vacuum table. | ||||||||||||||||||||
| HF circuits The tool less laser technology is ideal for building precise HF circuit geometries and does so at high structuring speeds. The repeatability precision essential for HF applications is guaranteed during product development for any number of iteration steps, as well as for the production of small batches. All standard high frequency substrates can be processed, e.g. PTFE, TMM, ceramics as well as FR4 in lower frequency ranges. | ||||||||||||||||||||
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| Further applications RFIDs on PET film substrates Structuring aluminium-coated substrates is usually a complicated task in RFID prototype development. Not so with the LPKF ProtoLaser S, which can simply and reliably process substrates such as coated PET films. The perfect tool for efficient on-demand prototype production or small batch production. | ||||||||||||||||||||
| HF Alters on ceramic substrates The LPKF ProtoLaser S really shows its class when processing metal-coated ceramics. The laser beam removes metal coating on ceramic substrates precisely and quickly - up to thicknesses of 300 pm! | ||||||||||||||||||||
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