| Basic knowledge printed circuit boards.............................93 Basic data to the selection of the correct machine and procedure....................................................................95 PCB structuring with LPKF ProtoLaser S............................97 Differences in the production of multilayer.......................98 Data preparation with LPKF software LPKF CircuitCAM...........................................................100 LPKF BoardMaster........................................................102 Milling..............................................................................104 Bonding multilayer...........................................................106 Marking and drilling.........................................................108 Cut out the printed circuit boaed.....................................108 Through-hole conductivity without chemicals..................109 Galvanic through-hole plating...........................................110 Solder-resist masks, legend printing. |