catalog - LPKF Laser & Electronics - #5

/ 132


catalogue search
P. 01
P. 02
P. 03
P. 04
P. 05
P. 06
P. 07
P. 08
P. 09
P. 10
P. 11
P. 12
P. 13
P. 14
P. 15
P. 16
P. 17
P. 18
P. 19
P. 20
P. 21
P. 22
P. 23
P. 24
P. 25
P. 26
P. 27
P. 28
P. 29
P. 30
P. 31
P. 32
P. 33
P. 34
P. 35
P. 36
P. 37
P. 38
P. 39
P. 40
P. 41
P. 42
P. 43
P. 44
P. 45
P. 46
P. 47
P. 48
P. 49
P. 50


See other catalogues for LPKF Laser & Electronics

Text version of the page
Multilayer Prototyping
Introduction to multilayer PCB production.........................64
LPKF MultiPress S
Bench-top hydraulic press for multilayer PCBs..................65
Special notes for multilayer board production...................67
Page 64
Surface Mount Technology/Finishing
Introduction to SMT prototyping........................................68
LPKF ProMask and ProLegend
In-house screenprinting and solder-resist masks..............69
LPKF ZelPrint LT300 and ZelPrint LT300 RP
SMT solder paste printer...................................................73
LPKF ProtoPlace
Pick & Place assembly system...........................................77
LPKF ProtoFlow and ProtoFlow N2
Lead-free reflow oven ideal for in-house
rapid PCB prototyping........................................................81
Review of rapid PCB prototyping for SMT circuitry............85
Page 68
<u in ra
w>
O.
Technical Guide
Page 92
Basic knowledge printed circuit boards.............................93
Basic data to the selection of the correct machine
and procedure....................................................................95
PCB structuring with LPKF ProtoLaser S............................97
Differences in the production of multilayer.......................98
Data preparation with LPKF software
LPKF CircuitCAM...........................................................100
LPKF BoardMaster........................................................102
Milling..............................................................................104
Bonding multilayer...........................................................106
Marking and drilling.........................................................108
Cut out the printed circuit boaed.....................................108
Through-hole conductivity without chemicals..................109
Galvanic through-hole plating...........................................110
Solder-resist masks, legend printing.
<U >> .5
3
5
w> c
IE w
'E
iZ
co
<u ;d
O .c
o
fi
Solder paste printing.........................................................113
Assembling.......................................................................114
Lead-free and lead containing reflow soldering................115
Applications......................................................................116
Other LPKF technical solutions.
88
124
Cross Reference List................................................119 LPKF distributors worldwide...............................126
Glossary.
127

pageCatalog pdf di En 2012-02-07-13