1520-fcbis
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3D Flip Chip Bump Inspection System Very fast 3D measurement system with automatic handling and sorting 100% quality control system with

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The LPKF FCBIS 3x is a precision 3D measuring machine for high speed inspection of units with micro structures like bumps on BGA-lnterposers. Based on the principles of confocal microscop the measuring data logging occures by scanning the object interface with a line sensor. - high throughput and continuous operation - low impact of surface properties (from highly reflective to light absorbing surfaces) - high aspect ratio for depth measurement The FCBIS is designed to measure small units (like BGA interposers) which are packed in standard trays. The system consists of an input and output...

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