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Catalogue Shrinking

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LEISTER Process Technologies - 81145, 14906

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Fitting a solder shrink connection Flameless shrink-wrapping of with HOT JET S and push-fit sieve industrial pallets and bulky goods with the reflector. FORTE S3. This allows work to

be carried out in closed spaces.

HOT JET S with spoon sieve reflector for solder shrinking.

Shrinking a solder sleeve with TRIAC PID.


Technical Data
Voltage	V~	42 120 200 230 230
Power consumption	W	1000 2700 3000 3400 2300
Frequency	Hz	50 / 60
Temperature	°C	20 - 650
Air flow (20°C)	l/min	320, manual air industrial slide
Pressure static	Pa	3000 (30 mbar)
Noise emission level LpA	dB	65
Size (L x 0)	mm	320 x 95, handle 0 64
Weight	kg	1.5 (with 3 m cord)
Marking of conformity		2
Approval mark		3
Certification scheme		CCA
Protection class II		0


Technical Data
Voltage	V~	3 x 230 3 x 400	3 x 440
Power consumption	W	10000 10000	10000
Frequency	Hz	50 / 60
Temperature	°C	650
Air flow (20°C)	l/min	1000
Pressure static	Pa	1200 (12 mbar)
Noise emission level LpA	dB	76
Size (L x W x H)	mm	390 x 132 x 215
Weight	kg	5.2 (with 10 m cord)
Marking of conformity		2
Approval mark		3
Certification scheme		CCA
Protection class II		0