MachXO Product Brief - Lattice Semiconductor - #4

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TransFR - Easy Field Updates
MachXO devices include Lattice's exclusive Transparent Field Reconfiguration (TransFR) technology. TransFR technology al­lows logic to be updated in the field without interrupting system operation.
Thanks to its dual SRAM and Flash configuration space archi­tecture, the MachXO requires less than 2mS to reconfigure, an order of magnitude lower than competing solutions. To change the logic configuration, simply program the Flash in the back­ground while the logic functions normally. In a single command, Lattice's ispVM® software locks the I/Os, copies Flash to SRAM, allows the data state to be initialized and unlocks the pins. Your logic is upgraded instantly!
ispLEVER Development Tools
Lattice's ispLEVER development tools offer a comprehensive design environment for the MachXO architecture. ispLEVER tools include everything you need for design entry, synthesis, map, place & route, floorplanning, simulation, project management, device pro­gramming and more. Synthesis and simulation tools from industry leaders Mentor Graphics and Synplicity are included with ispLEVER.
Evaluation and Development Boards
Lattice offers a number of evaluation and development boards that provide a ready-made platform to evaluate the performance of the MachXO device, or aid in development of custom designs. Go to www.latticesemi.com/boards for more information.
ispLeverCORE™ Intellectual Property
Lattice offers an expanding portfolio of IP cores and reference designs to support easy integration of commonly used functions. For the MachXO this includes:
FLASH (Configuration 2)
......
Logic - SRAM (Configuration 1)
ispLever CORE
• PCI Master/Target
• 8-bit Microcontroller
• SDRAM Memory Controllers
• PC Controller For additional IP cores, go to www.latticesemi.com/ip.
Program Flash in background while logic functions
JTAG commands control I/O & logic states while Flash is copied to SRAM -Device is operational in <2mS
Device Selection Guide
Parameter
LCMXO256
LCMXO640
LCMXO1200
LCMXO2280
LUTs
256
640
1200
2280
Distributed RAM (Kbits)
2
6.1
6.4
7.7
Embedded Block RAM - EBR (Kbits)
-
-
9.2
27.6
Number of EBR Blocks
- 13
Vcc Voltage (V) Options
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
Number of PLLs
--12
Number of I/O Banks
1 2 1 4 1 8 1 8
Maximum Number of I/Os
78
159
211
271
Maximum Number of LVDS Pairs*
-
-
27
33
Packages & I/O Combinations 100-pin TQFP (14 x 14 mm)**
78
74
73
73
144-pin TQFP (20 x 20 mm)
113
113
113
100-ball csBGA (8 x 8 mm)
78
74
132-ball csBGA (8 x 8 mm)
101
101
101
256-ball ftBGA (17 x 17 mm)
159
211
211
324-ball ftBGA (19 x 19 mm)
271
* Number of LVDS outputs can be increased by emulating with external resistors. ** In the 100-pin TQFP package, designs can not migrate from LCMXO640 to 1200.
Applications Support
1-800-LATTICE (528-8423) (503) 268-8001 techsupport@latticesemi.com
iiiLattice
; ; Semiconductor ■ ■■■■■ Corporation
More of the Best
www.latticesemi.com
Copyright © 2007 Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., and Lattice (design), ispLEVER, February 2007
ispLeverCORE, ispTRACY, ispVM, ispXP, MachXO, sysCLOCK, sysIO, sysMEM, and TransFR are either registered trademarks or trademarks of Lattice Order #: I0176D
Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

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