ispMACH 4000 Product Brief - Lattice Semiconductor - #4

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ispMACH 4000V/B/C Family Attributes
V = 3.3V, B = 2.5V, C = 1.8V core supply
Family Member
Macrocells
User I/O + Inputs
tPD
(ns)
(ns)
tS
(ns)
fMAX (MHz)
Vcc
(Volts)
Standby Current
at 1.8V (mA)
Package
ispMACH 4032V/B/C
32
30+2 32+4
2.5
2.2
1.8
400
3.3/2.5/1.8
1.3
44-pin TQFP 48-pin TQFP
ispMACH 4064V/B/C
64
30+2 32+4 64+10
2.5
2.2
1.8
400
3.3/2.5/1.8
1.5
44-pin TQFP 48-pin TQFP
100-pin TQFP
ispMACH 4128V/B/C
128
64+10 92+4 96+4
2.7
2.7
1.8
333
3.3/2.5/1.8
1.5
100-pin TQFP
128-pin TQFP
144-pin TQFP**
ispMACH 4256V/B/C
256
64+10 96+4 128+4 128+4/160+4
3.0
2.7
2.0
322
3.3/2.5/1.8
2.0
100-pin TQFP 144-pin TQFP**
176-pin TQFP 256-ball ftBGA*
ispMACH 4384V/B/C
384
128+4 192+4
3.5
2.7
2.0
322
3.3/2.5/1.8
2.5
176-pin TQFP 256-ball ftBGA
ispMACH 4512V/B/C
512
128+4
3.5
2.7
2.0
322
3.3/2.5/1.8
3.0
176-pin TQFP
208+4
256-ball ftBGA
*128 and 160 I/O options **3.3V only
ispMACH 4000 Advanced Packaging
ndustry's Lowest Power Consumption
180mA -A
1cm
48-Pin TQFP
7.00 к 7-00 mm
120mA
iiLattice
'cc
60mA
44-Pin TQFP
Ю00 * 10 00 rnm
100-Pin TQFP
14.00 к 14.00 mm
0mA
0MHz 100MHz 200MHz Frequency
Superior Performance
400MHz
300MHz
128-Pin TQFP
14.00 k 14.00 mm
144-Pin TQFP
20.00 X 20.00 mm 0.5 mm pilcti
Competitioi^^^
■ 70% I Faster
^4
300MHz Speed 200MHz
100MHz
10
32 64 128 256 384 512 Number of Macrocells
11
176-Pin TQFP
24.00 X 24.00 mm 0.5 mm pitch
256-Bail fIBGA
17.00X 17.00 mm 1.0 mm pitch
12
AppIications Support
1-800-LATTICE (528-8423) (503) 268-8001 techsupport@latticesemi.com
www.latticesemi.com
Packages are shown actual size. Dimensions refer to package body size.
JIILattice
^Semiconductor ■ ■■■■■ Corporation
More of the Best
Copyright © 2008 Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., and Lattice (design), E2CMOS, ISP, April 2008
ispMACH, ispLSI, ispLEVER, ispGDXV, SpeedLocked, SpeedLocking, and SuperFAST are either registered trademarks or trademarks of Lattice Semiconductor Order #: I0128C
Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

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